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GPU

TOSHIBA

Toshiba GT 330M

Graphics processor

Memory bus: 128 bit^*
Rated memory bandwidth: 25.28 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: Tesla 2.0^*
Process node: 40 nm^*
GPU cores: 48^*
Graphics interface: MXM-A (3.0)^*
Video memory: 1,024 MB^*
Reported chip die area: 100 mm²^*
Transistors: 486 million^*
Graphics processor: GT216^*
Texture mapping units: 16^*
Raster output units: 8^*
Streaming multiprocessors: 6^*
Chip foundry: TSMC^*
Card or module format: MXM Module^*
Declared GPU TDP: 23 W^*
External power connectors: None^*
DirectX / feature level: 11.1 (10_1)^*
OpenGL: 3.3^*
OpenCL: 1.1^*
CUDA compute capability: 1.2^*
Shader model: 4.1^*
GPU L2 cache: 64 KB^*

Memory & storage

Memory options: 1,024^*
Video memory type: GDDR3^*
Memory bus: 128 bit^*
Rated memory bandwidth: 25.28 GB/s^*

Power specifications

Thermal design power: 23 W^*

System configuration

Detailed specifications

Specifications 1 · 22 fields

proc transistors: 486 million^*
proc die size: 100^* mm²
cores: 48^*
sm count: 6^*
memory clock: 790^*
ram: 1,024^*
name: Toshiba GT 330M^*
ram type: GDDR3^*
bus width: 128^*
bus interface: MXM-A (3.0)^*
ram bandwidth: 25.28^* GB/s
fp32 performance: 0.1162^*
tdp: 23^* W
slot width: MXM Module^*
api cuda: 1.2^*
is retail board: Yes^*
gpi value: 0.65^*
manufacturer: TOSHIBA^*
arch name: Tesla 2.0^*
card release date: 2010-01-10^*
proc foundry: TSMC^*
proc process size: 40^* nm

Specifications 2 · 33 fields

CUDA compute capability

1.2^*

DirectX / feature level

11.1 (10_1)^*

OpenCL

1.1^*

OpenGL

3.3^*

Shader model

4.1^*

Architecture

Tesla 2.0^*

Graphics interface

MXM-A (3.0)^*

Memory bus

128^* bit

Reported shader processors

48^*

Reported theoretical FP32 peak

0.1162^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared GPU L2 cache

64 KB^*

Reported display outputs

Portable Device Dependent^*

Theoretical pixel fill rate

4.000 GPixel/s^*

External power connectors

None^*

Reported chip die area

100 mm²^*

Chip foundry

TSMC^*

Process node declaration

40 nm^*

Transistors

486 million^*

Graphics processor

GT216^*

Reported video memory

1,024^* MB

Rated memory bandwidth

25.28 GB/s^*

Video memory type

GDDR3^*

Raster output units

8^*

Reported shading units

48^*

Card or module format

MXM Module^*

Streaming multiprocessors

6^*

2:4 tensor sparsity

No^*

Declared GPU TDP

23 W^*

Theoretical texture fill rate

8.000 GTexel/s^*

Texture mapping units

16^*

GPU cores

48^*

Video memory

1,024^* MB

Video memory type

GDDR3^*

* Provisional data