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GPU

SPARKLE

SPARKLE 8400 GS P

Graphics processor

Memory bus: 64 bit^*
Rated memory bandwidth: 8 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: Tesla 2.0^*
Process node: 40 nm^*
GPU cores: 16^*
Graphics interface: PCI^*
Video memory: 512 MB^*
Reported chip die area: 57 mm²^*
Transistors: 260 million^*
Graphics processor: GT218S^*
Texture mapping units: 8^*
Raster output units: 4^*
Streaming multiprocessors: 2^*
Chip foundry: TSMC^*
Card or module format: Single-slot^*
Declared GPU TDP: 40 W^*
Suggested system PSU: 200 W^*
External power connectors: None^*
DirectX / feature level: 11.1 (10_1)^*
OpenGL: 3.3^*
OpenCL: 1.1^*
CUDA compute capability: 1.2^*
Shader model: 4.1^*
GPU L2 cache: 32 KB^*

Memory & storage

Memory options: 512^*
Video memory type: DDR3^*
Memory bus: 64 bit^*
Rated memory bandwidth: 8 GB/s^*

Power specifications

Thermal design power: 40 W^*

System configuration

Detailed specifications

Specifications 1 · 23 fields

proc transistors: 260 million^*
proc die size: 57^* mm²
cores: 16^*
sm count: 2^*
memory clock: 500^*
ram: 512^*
name: SPARKLE 8400 GS P^*
ram type: DDR3^*
bus width: 64^*
bus interface: PCI^*
ram bandwidth: 8^* GB/s
fp32 performance: 0.0394^*
tdp: 40^* W
suggested psu: 200^* W
slot width: Single-slot^*
api cuda: 1.2^*
is retail board: Yes^*
gpi value: 0.24^*
manufacturer: SPARKLE^*
arch name: Tesla 2.0^*
card release date: 2011-01-05^*
proc foundry: TSMC^*
proc process size: 40^* nm

Specifications 2 · 34 fields

CUDA compute capability

1.2^*

DirectX / feature level

11.1 (10_1)^*

OpenCL

1.1^*

OpenGL

3.3^*

Shader model

4.1^*

Architecture

Tesla 2.0^*

Graphics interface

PCI^*

Memory bus

64^* bit

Reported shader processors

16^*

Reported theoretical FP32 peak

0.0394^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared GPU L2 cache

32 KB^*

Reported display outputs

1x DVI, 1x HDMI, 1x VGA^*

Theoretical pixel fill rate

2.080 GPixel/s^*

External power connectors

None^*

Reported chip die area

57 mm²^*

Chip foundry

TSMC^*

Process node declaration

40 nm^*

Transistors

260 million^*

Graphics processor

GT218S^*

Reported video memory

512^* MB

Rated memory bandwidth

8.000 GB/s^*

Video memory type

DDR3^*

Raster output units

4^*

Reported shading units

16^*

Card or module format

Single-slot^*

Streaming multiprocessors

2^*

Suggested system PSU

200 W^*

2:4 tensor sparsity

No^*

Declared GPU TDP

40 W^*

Theoretical texture fill rate

4.160 GTexel/s^*

Texture mapping units

8^*

GPU cores

16^*

Video memory

512^* MB

Video memory type

DDR3^*

* Provisional data