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GPU
Sapphire

Sapphire R9 Nano

Graphics processor

Video memory
4 GB*
Memory bus
4,096 bit*
Rated memory bandwidth
512 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
GCN 3.0*
Process node
28 nm*
GPU cores
4,096*
Graphics interface
PCIe 3.0 x16*
Reported chip die area
596 mm²*
Transistors
8,900 million*
GPU L2 cache
2 MB*
Graphics processor
Fiji*
Texture mapping units
256*
Raster output units
64*
Chip foundry
TSMC*
Card or module format
Dual-slot*
Declared GPU TDP
175 W*
Suggested system PSU
450 W*
External power connectors
1x 8-pin*
DirectX / feature level
12 (12_0)*
OpenGL
4.6*
OpenCL
2.1*
Vulkan
1.2.170*
Shader model
6.5*

Memory & storage

Memory options
4*
Video memory
4 GB*
Video memory type
HBM*
Memory bus
4,096 bit*
Rated memory bandwidth
512 GB/s*

Power specifications

Thermal design power
175 W*

System configuration

Detailed specifications

Specifications 1 · 14 fields
Name
Sapphire R9 Nano*
6-Pin Connectors
0*
HDMI
1*
DisplayPort
3*
DVI
0*
VGA
0*
Boost Clock
1,000* MHz
Vram
4* GB
Memory Clock
1,000* MHz
TDP
175* W
Producer
Sapphire*
Length
152* mm
Slots
2*
8-Pin Connectors
1*
Specifications 2 · 24 fields
proc transistors
8,900 million*
proc die size
596* mm²
cores
4,096*
memory clock
500*
ram
4*
name
Sapphire R9 Nano*
ram type
HBM*
bus width
4,096*
bus interface
PCIe 3.0 x16*
ram bandwidth
512* GB/s
fp16 performance
8.192*
fp32 performance
8.192*
fp64 performance
0.512*
tdp
175* W
suggested psu
450* W
slot width
Dual-slot*
power connectors
1x 8-pin*
is retail board
Yes*
gpi value
7.61*
manufacturer
SAPPHIRE*
arch name
GCN 3.0*
card release date
2015-09-10*
proc foundry
TSMC*
proc process size
28* nm
Specifications 3 · 36 fields
DirectX / feature level
12 (12_0)*
OpenCL
2.1*
OpenGL
4.6*
Shader model
6.5*
Vulkan
1.2.170*
Architecture
GCN 3.0*
Graphics interface
PCIe 3.0 x16*
Memory bus
4,096* bit
Reported shader processors
4,096*
Reported theoretical FP16 peak
8.192* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP32 peak
8.192* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
0.512* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
16 KB (per CU)*
Declared GPU L2 cache
2 MB*
Reported display outputs
1x HDMI 1.4a, 3x DisplayPort 1.2*
Theoretical pixel fill rate
64.00 GPixel/s*
External power connectors
1x 8-pin*
Reported chip die area
596 mm²*
Chip foundry
TSMC*
Process node declaration
28 nm*
Transistors
8,900 million*
Graphics processor
Fiji*
Reported video memory
4* GB
Rated memory bandwidth
512.0 GB/s*
Video memory type
HBM*
Raster output units
64*
Reported shading units
4,096*
Card or module format
Dual-slot*
Suggested system PSU
450 W*
2:4 tensor sparsity
No*
Declared GPU TDP
175 W*
Theoretical texture fill rate
256.0 GTexel/s*
Texture mapping units
256*
GPU cores
4,096*
Video memory
4* GB
Video memory type
HBM*

* Provisional data