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GPU
Sapphire

Sapphire R9 290

Graphics processor

Video memory
4 GB*
Memory bus
512 bit*
Rated memory bandwidth
320 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
GCN 2.0*
Process node
28 nm*
GPU cores
2,560*
Graphics interface
PCIe 3.0 x16*
Reported chip die area
438 mm²*
Transistors
6,200 million*
Graphics processor
Hawaii*
Texture mapping units
160*
Raster output units
64*
Chip foundry
TSMC*
Card or module format
Dual-slot*
Declared GPU TDP
275 W*
Suggested system PSU
600 W*
External power connectors
1x 6-pin + 1x 8-pin*
DirectX / feature level
12 (12_0)*
OpenGL
4.6*
OpenCL
2.1*
Vulkan
1.2.170*
Shader model
6.5*
GPU L2 cache
1,024 KB*

Memory & storage

Memory options
4*
Video memory
4 GB*
Video memory type
GDDR5*
Memory bus
512 bit*
Rated memory bandwidth
320 GB/s*

Power specifications

Thermal design power
Reported value 1: 275 W*
Reported value 2: 300 W*

System configuration

Detailed specifications

Specifications 1 · 14 fields
Name
Sapphire R9 290*
6-Pin Connectors
1*
HDMI
1*
DisplayPort
1*
DVI
2*
VGA
0*
Boost Clock
947* MHz
Vram
4* GB
Memory Clock
5,000* MHz
TDP
300* W
Producer
Sapphire*
Length
277* mm
Slots
2*
8-Pin Connectors
1*
Specifications 2 · 23 fields
proc transistors
6,200 million*
proc die size
438* mm²
cores
2,560*
memory clock
1,250*
ram
4*
name
Sapphire R9 290*
ram type
GDDR5*
bus width
512*
bus interface
PCIe 3.0 x16*
ram bandwidth
320* GB/s
fp32 performance
4.849*
fp64 performance
0.6061*
tdp
275* W
suggested psu
600* W
slot width
Dual-slot*
power connectors
1x 6-pin + 1x 8-pin*
is retail board
Yes*
gpi value
4.21*
manufacturer
SAPPHIRE*
arch name
GCN 2.0*
card release date
2013-11-05*
proc foundry
TSMC*
proc process size
28* nm
Specifications 3 · 35 fields
DirectX / feature level
12 (12_0)*
OpenCL
2.1*
OpenGL
4.6*
Shader model
6.5*
Vulkan
1.2.170*
Architecture
GCN 2.0*
Graphics interface
PCIe 3.0 x16*
Memory bus
512* bit
Reported shader processors
2,560*
Reported theoretical FP32 peak
4.849* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
0.6061* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
16 KB (per CU)*
Declared GPU L2 cache
1024 KB*
Reported display outputs
2x DVI, 1x HDMI 1.4a, 1x DisplayPort 1.2*
Theoretical pixel fill rate
60.61 GPixel/s*
External power connectors
1x 6-pin + 1x 8-pin*
Reported chip die area
438 mm²*
Chip foundry
TSMC*
Process node declaration
28 nm*
Transistors
6,200 million*
Graphics processor
Hawaii*
Reported video memory
4* GB
Rated memory bandwidth
320.0 GB/s*
Video memory type
GDDR5*
Raster output units
64*
Reported shading units
2,560*
Card or module format
Dual-slot*
Suggested system PSU
600 W*
2:4 tensor sparsity
No*
Declared GPU TDP
275 W*
Theoretical texture fill rate
151.5 GTexel/s*
Texture mapping units
160*
GPU cores
2,560*
Video memory
4* GB
Video memory type
GDDR5*

* Provisional data