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GPU

GIGABYTE

GIGABYTE RTX 5050 WINDFORCE OC

Graphics processor

Video memory: 8 GB^*
Memory bus: 128 bit^*
Rated memory bandwidth: 320 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: Blackwell 2.0^*
Process node: 5 nm^*
GPU cores: 2,560^*
Graphics interface: PCIe 5.0 x8^*
Reported chip die area: 149 mm²^*
Transistors: 16,900 million^*
GPU L2 cache: 24 MB^*
Graphics processor: GB207^*
Texture mapping units: 80^*
Raster output units: 32^*
Streaming multiprocessors: 20^*
Tensor cores: 80^*
Ray tracing cores: 20^*
Chip foundry: TSMC^*
Card or module format: Dual-slot^*
Declared GPU TDP: 130 W^*
Suggested system PSU: 300 W^*
External power connectors: 1x 8-pin^*
DirectX / feature level: 12 Ultimate (12_2)^*
OpenGL: 4.6^*
OpenCL: 3.0^*
Vulkan: 1.4^*
CUDA compute capability: 12.0^*
Shader model: 6.9^*

Memory & storage

Memory options: 8^*
Video memory: 8 GB^*
Video memory type: GDDR6^*
Memory bus: 128 bit^*
Rated memory bandwidth: 320 GB/s^*

Power specifications

Thermal design power: 130 W^*

System configuration

Detailed specifications

Specifications 1 · 30 fields

proc transistors: 16,900 million^*
proc die size: 149^* mm²
cores: 2,560^*
tensor cores: 80^*
rt cores: 20^*
sm count: 20^*
base clock: 2,317^*
boost clock: 2,587^*
memory clock: 2,500^*
ram: 8^*
name: GIGABYTE RTX 5050 WINDFORCE OC^*
ram type: GDDR6^*
bus width: 128^*
bus interface: PCIe 5.0 x8^*
ram bandwidth: 320^* GB/s
fp16 performance: 13.25^*
fp32 performance: 13.25^*
fp64 performance: 0.207^*
tdp: 130^* W
suggested psu: 300^* W
slot width: Dual-slot^*
power connectors: 1x 8-pin^*
api cuda: 12^*
is retail board: Yes^*
gpi value: 7.08^*
manufacturer: GIGABYTE^*
arch name: Blackwell 2.0^*
card release date: 2025-07-01^*
proc foundry: TSMC^*
proc process size: 5^* nm

Specifications 2 · 39 fields

CUDA compute capability

12.0^*

DirectX / feature level

12 Ultimate (12_2)^*

OpenCL

3.0^*

OpenGL

4.6^*

Shader model

6.9^*

Vulkan

1.4^*

Architecture

Blackwell 2.0^*

Graphics interface

PCIe 5.0 x8^*

Memory bus

128^* bit

Reported shader processors

2,560^*

Reported theoretical FP16 peak

13.25^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP32 peak

13.25^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP64 peak

0.207^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared L1 cache configuration

128 KB (per SM)^*

Declared GPU L2 cache

24 MB^*

Reported display outputs

Active: 2x HDMI 2.1b, 2x DisplayPort 2.1b^*
Struck-out declarations: 1x HDMI 2.1b, 3x DisplayPort 2.1b^*

Theoretical pixel fill rate

82.78 GPixel/s^*

External power connectors

1x 8-pin^*

Reported chip die area

149 mm²^*

Chip foundry

TSMC^*

Process node declaration

5 nm^*

Transistors

16,900 million^*

Graphics processor

GB207^*

Reported video memory

8^* GB

Rated memory bandwidth

320.0 GB/s^*

Video memory type

GDDR6^*

Raster output units

32^*

Ray tracing cores

20^*

Reported shading units

2,560^*

Card or module format

Dual-slot^*

Streaming multiprocessors

20^*

Suggested system PSU

300 W^*

Declared GPU TDP

130 W^*

Tensor cores

80^*

Theoretical texture fill rate

207.0 GTexel/s^*

Texture mapping units

80^*

GPU cores

2,560^*

Video memory

8^* GB

Video memory type

GDDR6^*

* Provisional data