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GPU
AMD

AMD FireStream 9250

Graphics processor Released

Video memory
1 GB
Memory bus
256 bit
Rated memory bandwidth
63.60 GB/s

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
TeraScale 1
Manufacturing process
55 nm
Process node
55 nm
GPU cores
800*
Reported GPU frequency
625 MHz*
Graphics interface
PCIe 2.0 x16*
Video memory
1,024 MB*
Reported chip die area
256 mm²*
Chip/package TDP
150 W*
Transistors
956 million*
Graphics processor
RV770*
Texture mapping units
40*
Raster output units
16*
Chip foundry
TSMC*
Card or module format
Single-slot*
Declared GPU TDP
150 W*
Suggested system PSU
450 W*
External power connectors
1x 6-pin*
DirectX / feature level
10.1 (10_1)*
OpenGL
3.3*
OpenCL
1.1*
Shader model
4.1*
GPU L2 cache
256 KB*

GPU configurations

  • 1 GB / GDDR3 / 256-bit / RV770
    Capacity
    1 GB
    Rated memory bandwidth
    63.60 GB/s
    Chip variant
    RV770
    Reference clock
    625 MHz
    Memory bus
    256 bit
    Rated power
    150 W
    Power specification
    TDP
    Technology
    GDDR3

Memory & storage

Memory options
1,024*
Video memory
1 GB
Video memory type
GDDR3
Memory bus
256 bit
Rated memory bandwidth
63.60 GB/s

Power specifications

Thermal design power
150 W

System configuration

Detailed specifications

Specifications 1 · 12 fields
Foundry
TSMC*
Vendor
AMD*
FP32 GFLOPS
1,000* GFLOPS
FP64 GFLOPS
200* GFLOPS
Product
AMD FireStream 9250*
Type
GPU*
Release Date
2008-06-16*
Process Size (nm)
55* nm
TDP (W)
150* W
Die Size (mm^2)
256* mm²
Transistors (million)
956*
Freq (MHz)
625* MHz
Specifications 2 · 24 fields
proc transistors
956 million*
proc die size
256* mm²
cores
800*
memory clock
993*
ram
1,024*
name
AMD FireStream 9250*
ram type
GDDR3*
bus width
256*
bus interface
PCIe 2.0 x16*
ram bandwidth
63.55* GB/s
fp32 performance
1*
fp64 performance
0.2*
tdp
150* W
suggested psu
450* W
slot width
Single-slot*
power connectors
1x 6-pin*
is retail board
No*
gpi value
2.74*
vendor
amd*
manufacturer
AMD*
arch name
TeraScale*
card release date
2008-06-16*
proc foundry
TSMC*
proc process size
55* nm
Specifications 3 · 34 fields
DirectX / feature level
10.1 (10_1)*
OpenCL
1.1*
OpenGL
3.3*
Shader model
4.1*
Architecture
TeraScale*
Graphics interface
PCIe 2.0 x16*
Memory bus
256* bit
Reported shader processors
800*
Reported theoretical FP32 peak
1.0* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
0.2* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
16 KB (per CU)*
Declared GPU L2 cache
256 KB*
Reported display outputs
1x DVI*
Theoretical pixel fill rate
10.00 GPixel/s*
External power connectors
1x 6-pin*
Reported chip die area
256 mm²*
Chip foundry
TSMC*
Process node declaration
55 nm*
Transistors
956 million*
Graphics processor
RV770*
Reported video memory
1,024* MB
Rated memory bandwidth
63.55 GB/s*
Video memory type
GDDR3*
Raster output units
16*
Reported shading units
800*
Card or module format
Single-slot*
Suggested system PSU
450 W*
2:4 tensor sparsity
No*
Declared GPU TDP
150 W*
Theoretical texture fill rate
25.00 GTexel/s*
Texture mapping units
40*
GPU cores
800*
Video memory
1,024* MB
Video memory type
GDDR3*

* Provisional data