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GPU

AMD

AMD FireStream 9170

Graphics processor Released Nov 8, 2007

Video memory: 2 GB
Memory bus: 256 bit
Rated memory bandwidth: 51.20 GB/s

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: TeraScale 1
Manufacturing process: 55 nm
Process node: 55 nm
GPU cores: 320^*
Reported GPU frequency: 800 MHz^*
Graphics interface: PCIe 2.0 x16^*
Reported chip die area: 192 mm²^*
Chip/package TDP: 105 W^*
Transistors: 666 million^*
Graphics processor: RV670^*
Texture mapping units: 16^*
Raster output units: 16^*
Chip foundry: TSMC^*
Card or module format: Dual-slot^*
Declared GPU TDP: 105 W^*
Suggested system PSU: 300 W^*
External power connectors: 1x 6-pin^*
DirectX / feature level: 10.1 (10_1)^*
OpenGL: 3.3 (full) 4.0 (partial)^*
Shader model: 4.1^*
GPU L2 cache: 256 KB^*

GPU configurations

2 GB / GDDR3 / 256-bit / RV670
Capacity
2 GB
Rated memory bandwidth
51.20 GB/s
Chip variant
RV670
Reference clock
800 MHz
Memory bus
256 bit
Rated power
105 W
Power specification
TDP
Technology
GDDR3

Memory & storage

Memory options: 2^*
Video memory: 2 GB
Video memory type: GDDR3
Memory bus: 256 bit
Rated memory bandwidth: 51.20 GB/s

Power specifications

Thermal design power: 105 W

System configuration

Detailed specifications

Specifications 1 · 12 fields

Foundry: TSMC^*
Vendor: AMD^*
FP32 GFLOPS: 512^* GFLOPS
FP64 GFLOPS: 102.4^* GFLOPS
Product: AMD FireStream 9170^*
Type: GPU^*
Release Date: 2007-11-08^*
Process Size (nm): 55^* nm
TDP (W): 105^* W
Die Size (mm^2): 192^* mm²
Transistors (million): 666^*
Freq (MHz): 800^* MHz

Specifications 2 · 24 fields

proc transistors: 666 million^*
proc die size: 192^* mm²
cores: 320^*
memory clock: 802^*
ram: 2^*
name: AMD FireStream 9170^*
ram type: GDDR3^*
bus width: 256^*
bus interface: PCIe 2.0 x16^*
ram bandwidth: 51.33^* GB/s
fp32 performance: 0.4973^*
fp64 performance: 0.0995^*
tdp: 105^* W
suggested psu: 300^* W
slot width: Dual-slot^*
power connectors: 1x 6-pin^*
is retail board: No^*
gpi value: 0.7^*
vendor: amd^*
manufacturer: AMD^*
arch name: TeraScale^*
card release date: 2007-11-08^*
proc foundry: TSMC^*
proc process size: 55^* nm

Specifications 3 · 32 fields

DirectX / feature level

10.1 (10_1)^*

OpenGL

3.3 (full) 4.0 (partial)^*

Shader model

4.1^*

Architecture

TeraScale^*

Graphics interface

PCIe 2.0 x16^*

Memory bus

256^* bit

Reported shader processors

320^*

Reported theoretical FP32 peak

0.4973^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP64 peak

0.0995^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared GPU L2 cache

256 KB^*

Reported display outputs

2x DVI, 1x S-Video^*

Theoretical pixel fill rate

12.43 GPixel/s^*

External power connectors

1x 6-pin^*

Reported chip die area

192 mm²^*

Chip foundry

TSMC^*

Process node declaration

55 nm^*

Transistors

666 million^*

Graphics processor

RV670^*

Reported video memory

2^* GB

Rated memory bandwidth

51.33 GB/s^*

Video memory type

GDDR3^*

Raster output units

16^*

Reported shading units

320^*

Card or module format

Dual-slot^*

Suggested system PSU

300 W^*

2:4 tensor sparsity

No^*

Declared GPU TDP

105 W^*

Theoretical texture fill rate

12.43 GTexel/s^*

Texture mapping units

16^*

GPU cores

320^*

Video memory

2^* GB

Video memory type

GDDR3^*

* Provisional data