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GPU

AMD

AMD FirePro M8900

Graphics processor Released Apr 12, 2011

Video memory: 2 GB
Memory bus: 256 bit
Rated memory bandwidth: 115.20 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: TeraScale 2
Manufacturing process: 40 nm
Process node: 40 nm
GPU cores: 960^*
Reported GPU frequency: 680 MHz^*
Graphics interface: MXM-B (3.0)^*
Reported chip die area: 212 mm²^*
Chip/package TDP: 75 W^*
Transistors: 1,700 million^*
Graphics processor: Blackcomb^*
Texture mapping units: 48^*
Raster output units: 32^*
Chip foundry: TSMC^*
Card or module format: MXM Module^*
Declared GPU TDP: 75 W^*
External power connectors: None^*
DirectX / feature level: 11.2 (11_0)^*
OpenGL: 4.4^*
OpenCL: 1.2^*
Shader model: 5.0^*
GPU L2 cache: 512 KB^*

GPU configurations

2 GB / GDDR5 / 256-bit / Blackcomb XT GL
Capacity
2 GB
Chip variant
Blackcomb XT GL
Reference clock
680 MHz
Memory bus
256 bit
Technology
GDDR5

Memory & storage

Memory options: 2^*
Video memory: 2 GB
Video memory type: GDDR5
Memory bus: 256 bit
Rated memory bandwidth: 115.20 GB/s^*

Power specifications

Thermal design power: 75 W^*

System configuration

Detailed specifications

Specifications 1 · 11 fields

Foundry: TSMC^*
Vendor: AMD^*
FP32 GFLOPS: 1,306^* GFLOPS
Product: AMD FirePro M8900^*
Type: GPU^*
Release Date: 2011-04-12^*
Process Size (nm): 40^* nm
TDP (W): 75^* W
Die Size (mm^2): 212^* mm²
Transistors (million): 1,700^*
Freq (MHz): 680^* MHz

Specifications 2 · 21 fields

proc transistors: 1,700 million^*
proc die size: 212^* mm²
cores: 960^*
memory clock: 900^*
ram: 2^*
name: AMD FirePro M8900^*
ram type: GDDR5^*
bus width: 256^*
bus interface: MXM-B (3.0)^*
ram bandwidth: 115.2^* GB/s
fp32 performance: 1.3056^*
tdp: 75^* W
slot width: MXM Module^*
is retail board: No^*
gpi value: 1.4^*
vendor: amd^*
manufacturer: AMD^*
arch name: TeraScale 2^*
card release date: 2011-04-12^*
proc foundry: TSMC^*
proc process size: 40^* nm

Specifications 3 · 32 fields

DirectX / feature level

11.2 (11_0)^*

OpenCL

1.2^*

OpenGL

4.4^*

Shader model

5.0^*

Architecture

TeraScale 2^*

Graphics interface

MXM-B (3.0)^*

Memory bus

256^* bit

Reported shader processors

960^*

Reported theoretical FP32 peak

1.3056^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared L1 cache configuration

8 KB (per CU)^*

Declared GPU L2 cache

512 KB^*

Reported display outputs

Portable Device Dependent^*

Theoretical pixel fill rate

21.76 GPixel/s^*

External power connectors

None^*

Reported chip die area

212 mm²^*

Chip foundry

TSMC^*

Process node declaration

40 nm^*

Transistors

1,700 million^*

Graphics processor

Blackcomb^*

Reported video memory

2^* GB

Rated memory bandwidth

115.2 GB/s^*

Video memory type

GDDR5^*

Raster output units

32^*

Reported shading units

960^*

Card or module format

MXM Module^*

2:4 tensor sparsity

No^*

Declared GPU TDP

75 W^*

Theoretical texture fill rate

32.64 GTexel/s^*

Texture mapping units

48^*

GPU cores

960^*

Video memory

2^* GB

Video memory type

GDDR5^*

* Provisional data