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GPU

AMD

AMD FirePro M3900

Graphics processor Released Apr 13, 2011

Video memory: 1 GB
Memory bus: 64 bit
Rated memory bandwidth: 14.40 GB/s^*

Graphics & compute benchmarks

Archived cohort medians

GFXBench, GLBenchmark and CompuBench results retain the tested system, API, operating system and resolution. Offscreen tests fix the render resolution; onscreen results also reflect the display workload. These historical submissions do not establish performance in current games.

ALU 2Windows / OpenGL / 1366 x 768 / onscreen · fps

Higher is better.

AMD FirePro M3900

19.87^* fps

AMD FirePro M3900

Host configuration not reported.

Manhattan 3.1Windows / OpenGL / 1366 x 768 / onscreen · fps

Higher is better.

AMD FirePro M3900

13.56^* fps

AMD FirePro M3900

Host configuration not reported.

Median results, not the best run. Sample counts and individual test dates are unreported. Different systems using the same GPU remain separate configurations.

Processing & platform

Architecture: TeraScale 2
Manufacturing process: 40 nm
Process node: 40 nm
GPU cores: 160^*
Reported GPU frequency: 750 MHz^*
Graphics interface: PCIe 2.0 x16^*
Video memory: 1,024 MB^*
Reported chip die area: 67 mm²^*
Chip/package TDP: 20 W^*
Transistors: 370 million^*
Graphics processor: Seymour^*
Texture mapping units: 8^*
Raster output units: 4^*
Chip foundry: TSMC^*
Declared GPU TDP: 20 W^*
DirectX / feature level: 11.2 (11_0)^*
OpenGL: 4.4^*
OpenCL: 1.2^*
Shader model: 5.0^*
GPU L2 cache: 128 KB^*

GPU configurations

1 GB / DDR3 / 64-bit / Seymour XT
Capacity
1 GB
Chip variant
Seymour XT
Reference clock
700 MHz
Memory bus
64 bit
Technology
DDR3

Memory & storage

Memory options: 1,024^*
Video memory: 1 GB
Video memory type: DDR3
Memory bus: 64 bit
Rated memory bandwidth: 14.40 GB/s^*

Power specifications

Thermal design power: 20 W^*

System configuration

Detailed specifications

Specifications 1 · 11 fields

Foundry: TSMC^*
Vendor: AMD^*
FP32 GFLOPS: 240^* GFLOPS
Product: AMD FirePro M3900^*
Type: GPU^*
Release Date: 2010-10-19^*
Process Size (nm): 40^* nm
TDP (W): 20^* W
Die Size (mm^2): 67^* mm²
Transistors (million): 370^*
Freq (MHz): 750^* MHz

Specifications 2 · 20 fields

proc transistors: 370 million^*
proc die size: 67^* mm²
cores: 160^*
memory clock: 900^*
ram: 1,024^*
name: AMD FirePro M3900^*
ram type: GDDR3^*
bus width: 64^*
bus interface: PCIe 2.0 x16^*
ram bandwidth: 14.4^* GB/s
fp32 performance: 0.24^*
tdp: 20^* W
is retail board: No^*
gpi value: 0.81^*
vendor: amd^*
manufacturer: AMD^*
arch name: TeraScale 2^*
card release date: 2010-10-19^*
proc foundry: TSMC^*
proc process size: 40^* nm

Specifications 3 · 30 fields

DirectX / feature level

11.2 (11_0)^*

OpenCL

1.2^*

OpenGL

4.4^*

Shader model

5.0^*

Architecture

TeraScale 2^*

Graphics interface

PCIe 2.0 x16^*

Memory bus

64^* bit

Reported shader processors

160^*

Reported theoretical FP32 peak

0.24^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared L1 cache configuration

8 KB (per CU)^*

Declared GPU L2 cache

128 KB^*

Reported display outputs

Portable Device Dependent^*

Theoretical pixel fill rate

3.000 GPixel/s^*

Reported chip die area

67 mm²^*

Chip foundry

TSMC^*

Process node declaration

40 nm^*

Transistors

370 million^*

Graphics processor

Seymour^*

Reported video memory

1,024^* MB

Rated memory bandwidth

14.40 GB/s^*

Video memory type

GDDR3^*

Raster output units

4^*

Reported shading units

160^*

2:4 tensor sparsity

No^*

Declared GPU TDP

20 W^*

Theoretical texture fill rate

6.000 GTexel/s^*

Texture mapping units

8^*

GPU cores

160^*

Video memory

1,024^* MB

Video memory type

GDDR3^*

* Provisional data