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GPU

AMD

AMD FirePro 3D V3750

Graphics processor Released Sep 11, 2008

Video memory: 256 MB
Memory bus: 128 bit
Rated memory bandwidth: 24 GB/s

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: Terascale 1
Manufacturing process: 55 nm
Process node: 55 nm^*
GPU base clock: 550 MHz^*

GPU configurations

0.25 GB / GDDR3 / 128-bit / RV730 PRO
Capacity
256 MB
Rated memory bandwidth
24 GB/s
Chip variant
RV730 PRO
Reference clock
550 MHz
Memory bus
128 bit
Rated power
48 W
Power specification
TDP
Technology
GDDR3

Memory & storage

Video memory: 256 MB
Video memory type: GDDR3
Memory bus: 128 bit
Rated memory bandwidth: 24 GB/s

Power specifications

Thermal design power: 48 W

System configuration

Detailed specifications

Specifications · 9 fields

model

FirePro 3D V3750^*

Scope and conditions

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model: FirePro 3D V3750^*

core config

320(64×5):32:8:4^*

Scope and conditions

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model: FirePro 3D V3750^*

tdp watts

48.0^* W

Scope and conditions

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model: FirePro 3D V3750^*

manufacturer

AMD^*

Scope and conditions

source_native_row_context

model: FirePro 3D V3750^*

launch date

2008-09-11 00:00:00.000000000^*

Scope and conditions

source_native_row_context

model: FirePro 3D V3750^*

code name

RV730 PRO^*

Scope and conditions

source_native_row_context

model: FirePro 3D V3750^*

fab nm

55.0^* nm

Scope and conditions

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model: FirePro 3D V3750^*

bus interface

PCIe 2.0 ×16^*

Scope and conditions

source_native_row_context

model: FirePro 3D V3750^*

core clock mhz

550.0^* MHz

Scope and conditions

source_native_row_context

model: FirePro 3D V3750^*

* Provisional data