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GPU
AMD

AMD FirePro 2270 PCIe x1

Graphics processor

Memory bus
64 bit*
Rated memory bandwidth
9.60 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
TeraScale 2*
Process node
40 nm*
GPU cores
80*
Reported GPU frequency
600 MHz*
Graphics interface
PCIe 2.0 x1*
Video memory
512 MB*
Reported chip die area
59 mm²*
Chip/package TDP
15 W*
Transistors
292 million*
Graphics processor
Cedar*
Texture mapping units
8*
Raster output units
4*
Chip foundry
TSMC*
Card or module format
Single-slot*
Declared GPU TDP
15 W*
Suggested system PSU
200 W*
External power connectors
None*
DirectX / feature level
11.2 (11_0)*
OpenGL
4.4*
OpenCL
1.2*
Shader model
5.0*
GPU L2 cache
128 KB*

Memory & storage

Memory options
512*
Video memory type
GDDR3*
Memory bus
64 bit*
Rated memory bandwidth
9.60 GB/s*

Power specifications

Thermal design power
15 W*

System configuration

Detailed specifications

Specifications 1 · 11 fields
Foundry
TSMC*
Vendor
AMD*
FP32 GFLOPS
96* GFLOPS
Product
AMD FirePro 2270 PCIe x1*
Type
GPU*
Release Date
2011-01-31*
Process Size (nm)
40* nm
TDP (W)
15* W
Die Size (mm^2)
59* mm²
Transistors (million)
292*
Freq (MHz)
600* MHz
Specifications 2 · 22 fields
proc transistors
292 million*
proc die size
59* mm²
cores
80*
memory clock
600*
ram
512*
name
AMD FirePro 2270 PCIe x1*
ram type
GDDR3*
bus width
64*
bus interface
PCIe 2.0 x1*
ram bandwidth
9.6* GB/s
fp32 performance
0.096*
tdp
15* W
suggested psu
200* W
slot width
Single-slot*
is retail board
No*
gpi value
0.41*
vendor
amd*
manufacturer
AMD*
arch name
TeraScale 2*
card release date
2011-01-31*
proc foundry
TSMC*
proc process size
40* nm
Specifications 3 · 33 fields
DirectX / feature level
11.2 (11_0)*
OpenCL
1.2*
OpenGL
4.4*
Shader model
5.0*
Architecture
TeraScale 2*
Graphics interface
PCIe 2.0 x1*
Memory bus
64* bit
Reported shader processors
80*
Reported theoretical FP32 peak
0.096* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
8 KB (per CU)*
Declared GPU L2 cache
128 KB*
Reported display outputs
1x DMS-59*
Theoretical pixel fill rate
2.400 GPixel/s*
External power connectors
None*
Reported chip die area
59 mm²*
Chip foundry
TSMC*
Process node declaration
40 nm*
Transistors
292 million*
Graphics processor
Cedar*
Reported video memory
512* MB
Rated memory bandwidth
9.600 GB/s*
Video memory type
GDDR3*
Raster output units
4*
Reported shading units
80*
Card or module format
Single-slot*
Suggested system PSU
200 W*
2:4 tensor sparsity
No*
Declared GPU TDP
15 W*
Theoretical texture fill rate
4.800 GTexel/s*
Texture mapping units
8*
GPU cores
80*
Video memory
512* MB
Video memory type
GDDR3*

* Provisional data