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CPUXeon Phi SE10P
Processor
- CPU threads
- 244*
- Thermal design power
- 300 W*
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU threads
- 244*
- Base clock
- 1.1 GHz*
- CPU reference clock
- 100 MHz*
- Reported CPU clock
- 1.1 GHz*
- Socket / package
- PCIe x16*
- Process node
- 22 nm*
- Reported chip die area
- 350 mm²*
- Chip/package TDP
- 300 W*
- Transistors
- 5,000 million*
Power specifications
- Thermal design power
- 300 W*
System configuration
Detailed specifications
Specifications 1 · 8 fields
- Release
- Nov 12th, 2012*
- Name
- Xeon Phi SE10P*
- Codename
- Knights Corner*
- Cores
- 61 / 244*
- Clock
- 1,100* MHz
- Socket
- PCIe x16*
- Process
- 22* nm
- TDP
- 300* W
Specifications 2 · 24 fields
- name
- Xeon Phi SE10P*
- Release Date
- Nov 12th, 2012*
- Part#
- SE10P*
- Frequency
- 1,100* MHz
- Base Clock
- 100* MHz
- Multiplier
- 11.0x*
- Multiplier Unlocked
- No*
- Codename
- Knights Corner*
- Socket
- PCIe x16*
- Generation
- Xeon Phi (Knights Corner)*
- Memory Support
- DDR3, DDR4*
- ECC Memory
- Yes*
- # of Cores
- 61*
- # of Threads
- 244*
- SMP # CPUs
- 1*
- Cache L1
- 32 KB (per core)*
- Cache L2
- 512 KB (per core)*
- Features
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, AVX, AVX2, EIST, Intel 64, XD bit, TXT, VT-x, VT-d, AES-NI, ECC, HTT, FMA3, F16C, BMI1, BMI2, x8 SDDC, vPro*
- Foundry
- Intel*
- Process Size
- 22* nm
- Transistors
- 5,000 million*
- Die Size
- 350* mm²
- Package
- PCIe x16*
- Market
- Server/Workstation*
Specifications 3 · 10 fields
- Foundry
- Intel*
- Vendor
- Intel*
- Product
- Intel Xeon Phi SE10P*
- Type
- CPU*
- Release Date
- 2012-11-12*
- Process Size (nm)
- 22* nm
- TDP (W)
- 300* W
- Die Size (mm^2)
- 350* mm²
- Transistors (million)
- 5,000*
- Freq (MHz)
- 1,100* MHz
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* Provisional data