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CPU

Unspecified

Ryzen AI Max+ PRO 395

Processor

CPU cores: 16^*
CPU threads: 32^*
Maximum boost clock: 5.1 GHz^*
Thermal design power: 55 W^*

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 16^*
Graphics: Radeon 8060S Graphics ^*
CPU threads: 32^*
Base clock: 3 GHz^*
CPU reference clock: 100 MHz^*
Reported integrated GPU frequency: 2,900 MHz^*
Maximum boost clock: 5.1 GHz^*
L3 cache: 64 MB^*
L2 cache: 16 MB^*
Socket / package: Reported value 1: AMD Socket FP11^*
Reported value 2: FP11^*
Manufacturing process: TSMC 4nm FinFET^*

Memory & storage

Rated memory bandwidth: 256 GB/s^*

Supported memory

256-bit LPDDR5x^*

Power specifications

Thermal design power: 55 W^*

CPU power specifications

AMD configurable TDP^*
Power specification
cTDP^*
Minimum rating
45 W^*
Maximum rating
120 W^*

System configuration

Detailed specifications

Specifications 1 · 23 fields

Name

AMD Ryzen™ AI Max+ PRO 395^*

L3 Cache

64^* MB

Default TDP

55^* W

AMD Configurable TDP (cTDP)

45-120W^*

Processor Technology for CPU Cores

TSMC 4nm FinFET^*

CPU Socket

FP11^*

Family

Ryzen PRO^*

Max. Operating Temperature (Tjmax)

100^* °C

*OS Support

Windows 11 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit^*

PCI Express® Version

PCIe® 4.0^*

System Memory Type

256-bit LPDDR5x^*

Graphics Model

Radeon 8060S Graphics^*

Graphics Core Count

40^*

Graphics Frequency

2,900^* MHz

Series

Ryzen AI Max PRO 300 Series^*

AMD Ryzen™ AI

Available^*

Product ID Tray

100-000001243^*

Form Factor

Laptops, Desktops^*

# of CPU Cores

16^*

# of Threads

32^*

Max. Boost Clock

5.1^* GHz

Scope and conditions

source_native_row_context

Qualification: Up to^*
Original declaration: Up to 5.1 GHz^*

Base Clock

3^* GHz

L2 Cache

16^* MB

Specifications 2 · 34 fields

name: Ryzen AI Max+ PRO 395^*
Release Date: Jan 6th, 2025^*
Part#: 100-000001243^*
NPU: Yes / 50 TOPS^*
Frequency: 3^* GHz
Turbo Clock: up to 5.1 GHz^*
Base Clock: 100^* MHz
Multiplier: 30.0x^*
Multiplier Unlocked: No^*
Codename: Strix Halo^*
Socket: AMD Socket FP11^*
Generation: Ryzen AI Max (Zen 5 (Strix Halo))^*
Memory Support: LPDDR5X^*
ECC Memory: Yes^*
# of Cores: 16^*
# of Threads: 32^*
SMP # CPUs: 1^*
Integrated Graphics: Radeon 8060S^*
Cache L1: 80 KB (per core)^*
Cache L2: 1 MB (per core)^*
Features: MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES-NI, AVX, AVX2, AVX-512, BMI1, BMI2, SHA, F16C, FMA3, AMD64, EVP, VBS, DASH, AMD-V, AMD-V SVM, AMD-V RVI, AMD AVIC, AMD-Vi, SLAT, SMAP, SMEP, SMT, GMET, NX Bit, Windows Secured-Core, AMD Secure Processor, Precision Boost 2, XDNA2^*
Foundry: TSMC^*
Rated Speed: 8,000^* MT/s
Memory Bus: Quad-channel^*
Memory Bandwidth: 256^* GB/s
tJMax: 100°C^*
PCI-Express: Gen 4, 16 Lanes (CPU only)^*
Process Size: 4^* nm
Cache L3: 64 MB (shared)^*
Configurable TDP: 45-120 W^*
Memory Capacity: 128^* GB
Package: FC-BGA^*
Market: Mobile^*
Production Status: Active^*

* Provisional data