Core 2 Extreme X7900

Processor

CPU cores: 2^*
CPU threads: 2^*
Thermal design power: 44 W^*

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 2^*
CPU threads: 2^*
Base clock: 2.8 GHz^*
CPU reference clock: 200 MHz^*
Reported CPU clock: 2.8 GHz^*
Socket / package: Intel Socket P^*
Process node: 65 nm^*
Reported chip die area: 143 mm²^*
Chip/package TDP: 44 W^*
Hardware threads per core: 1^*

Power specifications

Thermal design power: 44 W^*

System configuration

Detailed specifications

Specifications 1 · 45 fields

ifu CPU microarchitecture: 5^*
metal layers Manufacturing process: 8^*
lsfu CPU microarchitecture: 2^*
metal Manufacturing process: copper^*
fpfu CPU microarchitecture: 4^*
model: X7900^*
date: 2007-08-01^*
clock: 2,800^*
max inst decoded CPU microarchitecture: 5^*
rob size CPU microarchitecture: 96^*
hw nthreadspercore: 1^*
iwindow CPU microarchitecture: 32^*
hw ncores: 2^*
tdp: 44^*
bus width: 64^*
arch int reg CPU microarchitecture: 8,533^*
transistors: 291^*
die size: 143^*
vdd low: 1.1^*
vdd high: 1.375^*
out of order CPU microarchitecture: t^*
integrated mc CPU microarchitecture: f^*
fanout Process gate-delay observation: 2^*
fanout Process gate-delay observation: 1^*
l1i CPU cache configuration: 32^*
name Processor code name: Merom^*
name CPU microarchitecture: Core:Merom^*
name Processor family: Core 2 Extreme^*
delay Process gate-delay observation: 6.65^*
delay Process gate-delay observation: 4.25^*
isa CPU microarchitecture: x86-64^*
l1d CPU cache configuration: 32^*
l2 shared CPU cache configuration: 4,096^*
name Manufacturing process: P1264^*
vdd Process gate-delay observation: 1.2^*
vdd Process gate-delay observation: 1.2^*
gate type Process gate-delay observation: inv^*
gate type Process gate-delay observation: inv^*
isa extensions CPU microarchitecture: SSE3^*
year Manufacturing process: 2005^*
technology Manufacturing process: CMOS^*
feature size Manufacturing process: 0.065^*
int pipestages CPU microarchitecture: 14^*
channel length Manufacturing process: 0.035^*
max uop issued per cycle CPU microarchitecture: 6^*

Specifications 2 · 33 fields

name: Core 2 Extreme X7900^*
Release Date: Aug 22nd, 2007^*
Part#: SLAF4 SLA33 QVVF QZDX^*
Frequency: 2.8^* GHz
Base Clock: 200^* MHz
Multiplier: 14.0x^*
Multiplier Unlocked: Yes^*
Voltage: 1.375^* V
TDP: 44^* W
Codename: Merom XE^*
Socket: Intel Socket P^*
Generation: Core 2 Extreme (Merom XE)^*
Memory Support: DDR2 Depends on motherboard^*
ECC Memory: No^*
# of Cores: 2^*
# of Threads: 2^*
SMP # CPUs: 1^*
Integrated Graphics: On certain motherboards (Chipset feature)^*
Cache L1: 64^* KB
Cache L2: 4^* MB
Features: MMX, SSE, SSE2, SSE3, SSSE3, EIST, Intel 64, XD bit, iAMT2, VT-x^*
Foundry: Intel^*
Memory Bus: Dual-channel^*
tJMax: 100°C^*
Launch Price: $851^*
Process Size: 65^* nm
Northbridge Location: Motherboard^*
Transistors: 291 million^*
Die Size: 143^* mm²
Max Power: 76^* W
Package: FC-PGA^*
Market: Mobile^*
Production Status: End-of-life^*

Specifications 3 · 9 fields

Foundry: Intel^*
Vendor: Intel^*
Product: Intel Core 2 Extreme X7900^*
Type: CPU^*
Release Date: 2007-08-01^*
Process Size (nm): 65^* nm
TDP (W): 44^* W
Die Size (mm^2): 143^* mm²
Freq (MHz): 2,800^* MHz

* Provisional data

Processing & platform

Power specifications

System configuration

Detailed specifications

Devices using this component