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CPU

AMD

AMD Ryzen 3 110

Processor Released Oct 1, 2025

CPU cores: 4
CPU threads: 8
Maximum boost clock: 4.3 GHz
Thermal design power: 28 W

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 4
Graphics: AMD Radeon 660M
CPU threads: 8
Base clock: 3 GHz
CPU reference clock: 100 MHz^*
Reported integrated GPU frequency: 1,800 MHz^*
L1 cache: 512 KB^*
Maximum boost clock: 4.3 GHz
L3 cache: 8 MB
L2 cache: 2 MB
Architecture: Zen 3+
Socket / package: AMD Socket FP7^*
Manufacturing process: TSMC 6nm FinFET
Process node: 6 nm

Cache hierarchy

L3 / total
Level
L3
Scope
total
Size
8 MB

Compatible sockets

FP7
FP7r2

Memory & storage

Memory channels: 2
Rated memory bandwidth: 76.80 GB/s^*

Supported memory

DDR5 (FP7r2) , LPDDR5 (FP7)^*

CPU memory support

DDR5 (FP7r2)
Variant / details
FP7r2
Technology
DDR5
LPDDR5 (FP7)
Variant / details
FP7
Technology
LPDDR5

Power specifications

Thermal design power: 28 W

CPU power specifications

Configurable TDP 15–30 W
Maximum rating
30 W
Minimum rating
15 W
Power specification
Configurable TDP
Variant / details
15-30W
AMD configurable TDP^*
Power specification
cTDP^*
Minimum rating
15 W^*
Maximum rating
30 W^*

System configuration

Detailed specifications

Specifications 1 · 26 fields

Name

AMD Ryzen™ 3 110^*

L3 Cache

8^* MB

Default TDP

28^* W

L1 Cache

512^* KB

AMD Configurable TDP (cTDP)

15-30W^*

Processor Technology for CPU Cores

TSMC 6nm FinFET^*

Unlocked for Overclocking

No^*

CPU Socket

FP7, FP7r2^*

Family

Ryzen^*

Max. Operating Temperature (Tjmax)

95^* °C

Launch Date

10/1/2025^*

*OS Support

RHEL x86 64-Bit , Ubuntu x86 64-Bit , Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition^*

PCI Express® Version

PCIe® 4.0^*

System Memory Type

DDR5 (FP7r2) , LPDDR5 (FP7)^*

Memory Channels

2^*

Graphics Model

AMD Radeon™ 660M^*

Graphics Core Count

4^*

Graphics Frequency

1,800^* MHz

Series

Ryzen 100 Series^*

Product ID Tray

100-000000537 (FP7) , 100-000000549 (FP7r2) , 100-000001960 (FP7r2)^*

Form Factor

Laptops, Desktops^*

# of CPU Cores

4^*

# of Threads

8^*

Max. Boost Clock

4.3^* GHz

Scope and conditions

source_native_row_context

Qualification: Up to^*
Original declaration: Up to 4.3 GHz^*

Base Clock

3^* GHz

L2 Cache

2^* MB

Specifications 2 · 33 fields

name: Ryzen 3 110^*
Release Date: Oct 1st, 2025^*
Part#: 100-000000549 (FP7r2)^*
Frequency: 3^* GHz
Turbo Clock: up to 4.3 GHz^*
Base Clock: 100^* MHz
Multiplier: 30.0x^*
Multiplier Unlocked: No^*
Codename: Rembrandt-R^*
Socket: AMD Socket FP7^*
Generation: Ryzen 3 (Zen 3+ (Rembrandt))^*
Memory Support: DDR5^*
ECC Memory: Yes^*
# of Cores: 4^*
# of Threads: 8^*
SMP # CPUs: 1^*
Integrated Graphics: Radeon 660M^*
Cache L1: 64 KB (per core)^*
Cache L2: 512 KB (per core)^*
Features: MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES, AVX, AVX2, BMI1, BMI2, SHA, F16C, FMA3, NX-Bit, AMD64, EVP, AMD-V, SMAP, SMEP, SMT, Precision Boost 2^*
Foundry: TSMC^*
Rated Speed: 4,800^* MT/s
Memory Bus: Dual-channel^*
Memory Bandwidth: 76.8^* GB/s
tJMax: 95°C^*
PCI-Express: Gen 4, 20 Lanes (CPU only)^*
Process Size: 6^* nm
Cache L3: 8 MB (shared)^*
Configurable TDP: 15-30 W^*
Die Size: 210^* mm²
Package: FP7r2^*
Market: Mobile^*
Production Status: Active^*

* Provisional data