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AcceleratorsTI TMS320LC31PQ40
Accelerators
- Process node
- 600 nm*
Processing & platform
- Process node
- 600 nm*
System configuration
Detailed specifications
Specifications · 37 fields
- Address bus declaration
- 24*
Scope and conditions
- Package
- Plastic BQFP-132*
- Architecture declaration
- 32*
Scope and conditions
- Package
- Plastic BQFP-132*
- Component type
- DSP*
Scope and conditions
- Package
- Plastic BQFP-132*
- Clone designation
- no*
Scope and conditions
- Package
- Plastic BQFP-132*
- Declared processor cores
- 1*
Scope and conditions
- Package
- Plastic BQFP-132*
- Core designer
- TI*
Scope and conditions
- Package
- Plastic BQFP-132*
- External data bus declaration
- 32*
Scope and conditions
- Package
- Plastic BQFP-132*
- Family
- TMS320*
Scope and conditions
- Package
- Plastic BQFP-132*
- Floating-point unit declaration
- Integrated*
Scope and conditions
- FPU implementation
- Integrated or external scope unspecified*
- Package
- Plastic BQFP-132*
- Maximum or typical clock declaration
- 40* MHz
Scope and conditions
- Clock type
- Maximum or typical; base or boost role unspecified*
- Package
- Plastic BQFP-132*
- Environmental designation
- RoHS & no Sb/Br*
Scope and conditions
- Package
- Plastic BQFP-132*
- I/O logic compatibility
- TTL*
Scope and conditions
- Package
- Plastic BQFP-132*
- Instruction-set architecture
- TMS320*
Scope and conditions
- Package
- Plastic BQFP-132*
- L1 data cache declaration
- No*
Scope and conditions
- Package
- Plastic BQFP-132*
- L1 instruction cache declaration
- 64 x 32-bit*
Scope and conditions
- Unit
- Unspecified*
- Package
- Plastic BQFP-132*
- Unified L1 cache declaration
- No*
Scope and conditions
- Package
- Plastic BQFP-132*
- L2 cache declaration
- No*
Scope and conditions
- Package
- Plastic BQFP-132*
- L3 cache declaration
- No*
Scope and conditions
- Package
- Plastic BQFP-132*
- Power-saving features
- Two low-power modes*
Scope and conditions
- Package
- Plastic BQFP-132*
- Manufacturer
- TI*
Scope and conditions
- Package
- Plastic BQFP-132*
- Metal layers
- 3*
Scope and conditions
- Package
- Plastic BQFP-132*
- Military specification declaration
- no*
Scope and conditions
- Package
- Plastic BQFP-132*
- Multiprocessing declaration
- Yes*
Scope and conditions
- Package
- Plastic BQFP-132*
- On-chip peripherals
- Clock generator*
- timer*
- serial*
- DMA*
Scope and conditions
- Package
- Plastic BQFP-132*
- Package
- Plastic BQFP-132*
- Part number
- TMS320LC31PQ40*
Scope and conditions
- Package
- Plastic BQFP-132*
- Fabrication node declaration
- 0.6* µm
Scope and conditions
- Package
- Plastic BQFP-132*
- Fabrication technology
- Enhanced Performance Implanted CMOS (EPIC)*
Scope and conditions
- Package
- Plastic BQFP-132*
- On-chip RAM declaration
- two 1k x 32-bit*
Scope and conditions
- Unit
- Unspecified*
- Package
- Plastic BQFP-132*
- Maximum RAM declaration
- 64* MiB
Scope and conditions
- Package
- Plastic BQFP-132*
- ROM type
- Boot program loader*
Scope and conditions
- Package
- Plastic BQFP-132*
- Subfamily
- TMS320C31*
Scope and conditions
- Package
- Plastic BQFP-132*
- Temperature grade
- Commercial*
Scope and conditions
- Package
- Plastic BQFP-132*
- Temperature range declaration
- 0* – 85* °C
Scope and conditions
- Temperature reference
- Unspecified*
- Package
- Plastic BQFP-132*
- Core supply voltage range
- 3.13* – 3.47* V
Scope and conditions
- Package
- Plastic BQFP-132*
- Typical core supply voltage
- 3.3* V
Scope and conditions
- Package
- Plastic BQFP-132*
- I/O supply voltage
- 3.3* V
Scope and conditions
- Package
- Plastic BQFP-132*
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* Provisional data