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GPU

SAPPHIRE

Sapphire Vapor-X R9 290 Tri-X

Graphics processor

Video memory: 4 GB^*
Memory bus: 512 bit^*
Rated memory bandwidth: 358.40 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: GCN 2.0^*
Process node: 28 nm^*
GPU cores: 2,560^*
Graphics interface: PCIe 3.0 x16^*
Reported chip die area: 438 mm²^*
Transistors: 6,200 million^*
Graphics processor: Hawaii^*
Texture mapping units: 160^*
Raster output units: 64^*
Chip foundry: TSMC^*
Card or module format: Dual-slot^*
Declared GPU TDP: 275 W^*
Suggested system PSU: 600 W^*
External power connectors: 2x 8-pin^*
DirectX / feature level: 12 (12_0)^*
OpenGL: 4.6^*
OpenCL: 2.1^*
Vulkan: 1.2.170^*
Shader model: 6.5^*
GPU L2 cache: 1,024 KB^*

Memory & storage

Memory options: 4^*
Video memory: 4 GB^*
Video memory type: GDDR5^*
Memory bus: 512 bit^*
Rated memory bandwidth: 358.40 GB/s^*

Power specifications

Thermal design power: 275 W^*

System configuration

Detailed specifications

Specifications 1 · 23 fields

proc transistors: 6,200 million^*
proc die size: 438^* mm²
cores: 2,560^*
memory clock: 1,400^*
ram: 4^*
name: Sapphire Vapor-X R9 290 Tri-X^*
ram type: GDDR5^*
bus width: 512^*
bus interface: PCIe 3.0 x16^*
ram bandwidth: 358.4^* GB/s
fp32 performance: 5.12^*
fp64 performance: 0.64^*
tdp: 275^* W
suggested psu: 600^* W
slot width: Dual-slot^*
power connectors: 2x 8-pin^*
is retail board: Yes^*
gpi value: 4.44^*
manufacturer: SAPPHIRE^*
arch name: GCN 2.0^*
card release date: 2014-04-29^*
proc foundry: TSMC^*
proc process size: 28^* nm

Specifications 2 · 35 fields

DirectX / feature level

12 (12_0)^*

OpenCL

2.1^*

OpenGL

4.6^*

Shader model

6.5^*

Vulkan

1.2.170^*

Architecture

GCN 2.0^*

Graphics interface

PCIe 3.0 x16^*

Memory bus

512^* bit

Reported shader processors

2,560^*

Reported theoretical FP32 peak

5.12^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP64 peak

0.64^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared L1 cache configuration

16 KB (per CU)^*

Declared GPU L2 cache

1024 KB^*

Reported display outputs

2x DVI, 1x HDMI 1.4a, 1x DisplayPort 1.2^*

Theoretical pixel fill rate

64.00 GPixel/s^*

External power connectors

2x 8-pin^*

Reported chip die area

438 mm²^*

Chip foundry

TSMC^*

Process node declaration

28 nm^*

Transistors

6,200 million^*

Graphics processor

Hawaii^*

Reported video memory

4^* GB

Rated memory bandwidth

358.4 GB/s^*

Video memory type

GDDR5^*

Raster output units

64^*

Reported shading units

2,560^*

Card or module format

Dual-slot^*

Suggested system PSU

600 W^*

2:4 tensor sparsity

No^*

Declared GPU TDP

275 W^*

Theoretical texture fill rate

160.0 GTexel/s^*

Texture mapping units

160^*

GPU cores

2,560^*

Video memory

4^* GB

Video memory type

GDDR5^*

* Provisional data