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GPU

NVIDIA

NVIDIA H800 SXM5

Graphics processor

Video memory: 80 GB^*
Memory bus: 5,120 bit^*
Rated memory bandwidth: 3,360 GB/s^*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture: Hopper^*
Process node: 5 nm^*
GPU cores: 16,896^*
Graphics interface: PCIe 5.0 x16^*
Reported chip die area: 814 mm²^*
Transistors: 80,000 million^*
GPU L2 cache: 50 MB^*
Graphics processor: GH100^*
Texture mapping units: 528^*
Raster output units: 24^*
Streaming multiprocessors: 132^*
Tensor cores: 528^*
Chip foundry: TSMC^*
Card or module format: SXM Module^*
Declared GPU TDP: 700 W^*
Suggested system PSU: 1,100 W^*
External power connectors: 8-pin EPS^*
OpenCL: 3.0^*
CUDA compute capability: 9.0^*

Memory & storage

Memory options: 80^*
Video memory: 80 GB^*
Video memory type: HBM3^*
Memory bus: 5,120 bit^*
Rated memory bandwidth: 3,360 GB/s^*

Power specifications

Thermal design power: 700 W^*

System configuration

Detailed specifications

Specifications 1 · 30 fields

proc transistors: 80,000 million^*
proc die size: 814^* mm²
cores: 16,896^*
tensor cores: 528^*
sm count: 132^*
base clock: 1,095^*
boost clock: 1,755^*
memory clock: 1,313^*
ram: 80^*
name: NVIDIA H800 SXM5^*
ram type: HBM3^*
bus width: 5,120^*
bus interface: PCIe 5.0 x16^*
ram bandwidth: 3.36 TB/s^*
fp16 performance: 237.2^*
fp32 performance: 59.3^*
fp64 performance: 29.65^*
tdp: 700^* W
suggested psu: 1,100^* W
slot width: SXM Module^*
power connectors: 8-pin EPS^*
api cuda: 9^*
is retail board: No^*
gpi value: 52.75^*
vendor: nvd^*
manufacturer: NVIDIA^*
arch name: Hopper^*
card release date: 2023-03-21^*
proc foundry: TSMC^*
proc process size: 5^* nm

Specifications 2 · 33 fields

CUDA compute capability

9.0^*

OpenCL

3.0^*

Graphics interface

PCIe 5.0 x16^*

Memory bus

5,120^* bit

Reported shader processors

16,896^*

Reported theoretical FP16 peak

237.2^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP32 peak

59.3^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Reported theoretical FP64 peak

29.65^* TFLOPS

Scope and conditions

Arithmetic density: Not stated^*

Declared L1 cache configuration

256 KB (per SM)^*

Declared GPU L2 cache

50 MB^*

Reported display outputs

No outputs^*

Theoretical pixel fill rate

42.12 GPixel/s^*

External power connectors

8-pin EPS^*

Reported chip die area

814 mm²^*

Chip foundry

TSMC^*

Process node declaration

5 nm^*

Transistors

80,000 million^*

Graphics processor

GH100^*

Reported video memory

80^* GB

Rated memory bandwidth

3.36 TB/s^*

Video memory type

HBM3^*

Raster output units

24^*

Reported shading units

16,896^*

Card or module format

SXM Module^*

Streaming multiprocessors

132^*

Suggested system PSU

1100 W^*

Declared GPU TDP

700 W^*

Tensor cores

528^*

Theoretical texture fill rate

926.6 GTexel/s^*

Texture mapping units

528^*

GPU cores

16,896^*

Video memory

80^* GB

Video memory type

HBM3^*

* Provisional data