GeekRadar / The comparison desk
COMPARE.
GPU
Gigabyte

Gigabyte HD 7970 Windforce 3X OC

Graphics processor

Video memory
3 GB*
Memory bus
384 bit*
Rated memory bandwidth
288 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
GCN 1.0*
Process node
28 nm*
GPU cores
2,048*
Graphics interface
PCIe 3.0 x16*
Reported chip die area
352 mm²*
Transistors
4,313 million*
Graphics processor
Tahiti*
Texture mapping units
128*
Raster output units
32*
Chip foundry
TSMC*
Card or module format
Dual-slot*
Declared GPU TDP
300 W*
Suggested system PSU
700 W*
External power connectors
1x 6-pin + 1x 8-pin*
DirectX / feature level
12 (11_1)*
OpenGL
4.6*
OpenCL
2.1 (1.2)*
Vulkan
1.2.170*
Shader model
6.5 (5.1)*
GPU L2 cache
768 KB*

Memory & storage

Memory options
3*
Video memory
3 GB*
Video memory type
GDDR5*
Memory bus
384 bit*
Rated memory bandwidth
288 GB/s*

Power specifications

Thermal design power
Reported value 1: 250 W*
Reported value 2: 300 W*

System configuration

Detailed specifications

Specifications 1 · 14 fields
Name
Gigabyte HD 7970 Windforce 3X OC*
6-Pin Connectors
1*
HDMI
1*
DisplayPort
2*
DVI
1*
VGA
0*
Boost Clock
1,000* MHz
Vram
3* GB
Memory Clock
5,500* MHz
TDP
250* W
Producer
Gigabyte*
Length
285* mm
Slots
2*
8-Pin Connectors
1*
Specifications 2 · 25 fields
proc transistors
4,313 million*
proc die size
352* mm²
cores
2,048*
base clock
1,050*
boost clock
1,100*
memory clock
1,500*
ram
3*
name
GIGABYTE HD 7970 WindForce 3X OC*
ram type
GDDR5*
bus width
384*
bus interface
PCIe 3.0 x16*
ram bandwidth
288* GB/s
fp32 performance
4.506*
fp64 performance
1.1264*
tdp
300* W
suggested psu
700* W
slot width
Dual-slot*
power connectors
1x 6-pin + 1x 8-pin*
is retail board
Yes*
gpi value
3.69*
manufacturer
GIGABYTE*
arch name
GCN 1.0*
card release date
2012-07-16*
proc foundry
TSMC*
proc process size
28* nm
Specifications 3 · 35 fields
DirectX / feature level
12 (11_1)*
OpenCL
2.1 (1.2)*
OpenGL
4.6*
Shader model
6.5 (5.1)*
Vulkan
1.2.170*
Architecture
GCN 1.0*
Graphics interface
PCIe 3.0 x16*
Memory bus
384* bit
Reported shader processors
2,048*
Reported theoretical FP32 peak
4.506* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
1.1264* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
16 KB (per CU)*
Declared GPU L2 cache
768 KB*
Reported display outputs
1x DVI, 1x HDMI 1.4a, 2x mini-DisplayPort 1.2*
Theoretical pixel fill rate
35.20 GPixel/s*
External power connectors
1x 6-pin + 1x 8-pin*
Reported chip die area
352 mm²*
Chip foundry
TSMC*
Process node declaration
28 nm*
Transistors
4,313 million*
Graphics processor
Tahiti*
Reported video memory
3* GB
Rated memory bandwidth
288.0 GB/s*
Video memory type
GDDR5*
Raster output units
32*
Reported shading units
2,048*
Card or module format
Dual-slot*
Suggested system PSU
700 W*
2:4 tensor sparsity
No*
Declared GPU TDP
300 W*
Theoretical texture fill rate
140.8 GTexel/s*
Texture mapping units
128*
GPU cores
2,048*
Video memory
3* GB
Video memory type
GDDR5*

* Provisional data