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GPU
COLORFIRE

ColorFire HD 6850 X2 XStorm

Graphics processor

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
TeraScale 2*
Process node
40 nm*
GPUs per card
2*
Graphics interface
PCIe 2.0 x16*
Reported chip die area
255 mm²*
Transistors
1,700 million*
Graphics processor
Barts*
Chip foundry
TSMC*
Card or module format
Dual-slot*
Declared GPU TDP
254 W*
Suggested system PSU
600 W*
External power connectors
2x 8-pin*
DirectX / feature level
11.2 (11_0)*
OpenGL
4.4*
OpenCL
1.2*
Shader model
5.0*
Reported video memory (allocation unspecified)
2 GB*
Reported shader processors (allocation unspecified)
960*
Reported memory bandwidth (allocation unspecified)
134.40 GB/s*

Memory & storage

Video memory type
GDDR5*

Power specifications

Thermal design power
254 W*

System configuration

Detailed specifications

Specifications 1 · 22 fields
proc transistors
1,700 million*
proc die size
255* mm²
Reported shader processors (allocation unspecified)
960*
memory clock
1,050*
Reported video memory (allocation unspecified)
2*
name
ColorFire HD 6850 X2 XStorm*
ram type
GDDR5*
bus width
256*
bus interface
PCIe 2.0 x16*
Reported memory bandwidth (allocation unspecified)
134.4* GB/s
fp32 performance
1.536*
tdp
254* W
suggested psu
600* W
slot width
Dual-slot*
power connectors
2x 8-pin*
is retail board
Yes*
gpi value
1.68*
manufacturer
COLORFIRE*
arch name
TeraScale 2*
card release date
2011-09-19*
proc foundry
TSMC*
proc process size
40* nm
Specifications 2 · 34 fields
DirectX / feature level
11.2 (11_0)*
OpenCL
1.2*
OpenGL
4.4*
Shader model
5.0*
Architecture
TeraScale 2*
Graphics interface
PCIe 2.0 x16*
Memory bus (allocation unspecified)
256* bit
Reported shader processors (allocation unspecified)
960*
Reported theoretical FP32 peak
1.536* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
8 KB (per CU)*
Declared GPU L2 cache (allocation unspecified)
512 KB*
Reported display outputs
2x DVI, 1x HDMI 1.3a, 1x DisplayPort 1.1*
Theoretical pixel fill rate
25.60 GPixel/s*
External power connectors
2x 8-pin*
Reported chip die area
255 mm²*
Chip foundry
TSMC*
Process node declaration
40 nm*
Transistors
1,700 million*
Graphics processor
Barts*
GPUs per card
2*
Reported video memory (allocation unspecified)
2* GB
Rated memory bandwidth (allocation unspecified)
134.4 GB/s*
Video memory type
GDDR5*
Raster output units (allocation unspecified)
32*
Reported shading units (allocation unspecified)
960*
Card or module format
Dual-slot*
Suggested system PSU
600 W*
2:4 tensor sparsity
No*
Declared GPU TDP
254 W*
Theoretical texture fill rate
38.40 GTexel/s*
Texture mapping units (allocation unspecified)
48*
Reported shader processors (allocation unspecified)
960*
Reported video memory (allocation unspecified)
2* GB
Video memory type
GDDR5*

* Provisional data