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GPU
AMD

AMD FireStream 9350

Graphics processor Released

Video memory
2 GB
Memory bus
256 bit
Rated memory bandwidth
128 GB/s

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
TeraScale 2
Manufacturing process
40 nm
Process node
40 nm
GPU cores
1,440*
Reported GPU frequency
700 MHz*
Graphics interface
PCIe 2.0 x16*
Reported chip die area
334 mm²*
Chip/package TDP
150 W*
Transistors
2,154 million*
Graphics processor
Cypress*
Texture mapping units
72*
Raster output units
32*
Chip foundry
TSMC*
Card or module format
Single-slot*
Declared GPU TDP
150 W*
Suggested system PSU
450 W*
External power connectors
1x 6-pin*
DirectX / feature level
11.2 (11_0)*
OpenGL
4.4*
OpenCL
1.2*
Shader model
5.0*
GPU L2 cache
512 KB*

GPU configurations

  • 2 GB / GDDR5 / 256-bit / Cypress XT
    Capacity
    2 GB
    Rated memory bandwidth
    128 GB/s
    Chip variant
    Cypress XT
    Reference clock
    700 MHz
    Memory bus
    256 bit
    Rated power
    150 W
    Power specification
    TDP
    Technology
    GDDR5

Memory & storage

Memory options
2*
Video memory
2 GB
Video memory type
GDDR5
Memory bus
256 bit
Rated memory bandwidth
128 GB/s

Power specifications

Thermal design power
150 W

System configuration

Detailed specifications

Specifications 1 · 12 fields
Foundry
TSMC*
Vendor
AMD*
FP32 GFLOPS
2,016* GFLOPS
FP64 GFLOPS
403.2* GFLOPS
Product
AMD FireStream 9350*
Type
GPU*
Release Date
2010-06-01*
Process Size (nm)
40* nm
TDP (W)
150* W
Die Size (mm^2)
334* mm²
Transistors (million)
2,154*
Freq (MHz)
700* MHz
Specifications 2 · 24 fields
proc transistors
2,154 million*
proc die size
334* mm²
cores
1,440*
memory clock
1,000*
ram
2*
name
AMD FireStream 9350*
ram type
GDDR5*
bus width
256*
bus interface
PCIe 2.0 x16*
ram bandwidth
128* GB/s
fp32 performance
2.016*
fp64 performance
0.4032*
tdp
150* W
suggested psu
450* W
slot width
Single-slot*
power connectors
1x 6-pin*
is retail board
No*
gpi value
1.82*
vendor
amd*
manufacturer
AMD*
arch name
TeraScale 2*
card release date
2010-06-01*
proc foundry
TSMC*
proc process size
40* nm
Specifications 3 · 34 fields
DirectX / feature level
11.2 (11_0)*
OpenCL
1.2*
OpenGL
4.4*
Shader model
5.0*
Architecture
TeraScale 2*
Graphics interface
PCIe 2.0 x16*
Memory bus
256* bit
Reported shader processors
1,440*
Reported theoretical FP32 peak
2.016* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
0.4032* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
8 KB (per CU)*
Declared GPU L2 cache
512 KB*
Reported display outputs
1x DisplayPort 1.1*
Theoretical pixel fill rate
22.40 GPixel/s*
External power connectors
1x 6-pin*
Reported chip die area
334 mm²*
Chip foundry
TSMC*
Process node declaration
40 nm*
Transistors
2,154 million*
Graphics processor
Cypress*
Reported video memory
2* GB
Rated memory bandwidth
128.0 GB/s*
Video memory type
GDDR5*
Raster output units
32*
Reported shading units
1,440*
Card or module format
Single-slot*
Suggested system PSU
450 W*
2:4 tensor sparsity
No*
Declared GPU TDP
150 W*
Theoretical texture fill rate
50.40 GTexel/s*
Texture mapping units
72*
GPU cores
1,440*
Video memory
2* GB
Video memory type
GDDR5*

* Provisional data