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GPU
AMD

AMD FirePro S9010

Graphics processor

Video memory
3 GB*
Memory bus
384 bit*
Rated memory bandwidth
240 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
GCN 1.0*
Process node
28 nm*
GPU cores
1,792*
Reported GPU frequency
800 MHz*
Graphics interface
PCIe 3.0 x16*
Reported chip die area
352 mm²*
Chip/package TDP
200 W*
Transistors
4,313 million*
Graphics processor
Tahiti*
Texture mapping units
112*
Raster output units
32*
Chip foundry
TSMC*
Card or module format
Dual-slot*
Declared GPU TDP
200 W*
Suggested system PSU
550 W*
External power connectors
2x 6-pin*
DirectX / feature level
12 (11_1)*
OpenGL
4.6*
OpenCL
2.1 (1.2)*
Vulkan
1.2.170*
Shader model
6.5 (5.1)*
GPU L2 cache
768 KB*

Memory & storage

Memory options
3*
Video memory
3 GB*
Video memory type
GDDR5*
Memory bus
384 bit*
Rated memory bandwidth
240 GB/s*

Power specifications

Thermal design power
200 W*

System configuration

Detailed specifications

Specifications 1 · 12 fields
Foundry
TSMC*
Vendor
AMD*
FP32 GFLOPS
2,867* GFLOPS
FP64 GFLOPS
716.8* GFLOPS
Product
AMD FirePro S9010*
Type
GPU*
Release Date
2012-08-24*
Process Size (nm)
28* nm
TDP (W)
200* W
Die Size (mm^2)
352* mm²
Transistors (million)
4,313*
Freq (MHz)
800* MHz
Specifications 2 · 24 fields
proc transistors
4,313 million*
proc die size
352* mm²
cores
1,792*
memory clock
1,250*
ram
3*
name
AMD FirePro S9010*
ram type
GDDR5*
bus width
384*
bus interface
PCIe 3.0 x16*
ram bandwidth
240* GB/s
fp32 performance
2.867*
fp64 performance
0.7168*
tdp
200* W
suggested psu
550* W
slot width
Dual-slot*
power connectors
2x 6-pin*
is retail board
No*
gpi value
2.77*
vendor
amd*
manufacturer
AMD*
arch name
GCN 1.0*
card release date
2012-08-24*
proc foundry
TSMC*
proc process size
28* nm
Specifications 3 · 35 fields
DirectX / feature level
12 (11_1)*
OpenCL
2.1 (1.2)*
OpenGL
4.6*
Shader model
6.5 (5.1)*
Vulkan
1.2.170*
Architecture
GCN 1.0*
Graphics interface
PCIe 3.0 x16*
Memory bus
384* bit
Reported shader processors
1,792*
Reported theoretical FP32 peak
2.867* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported theoretical FP64 peak
0.7168* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Declared L1 cache configuration
16 KB (per CU)*
Declared GPU L2 cache
768 KB*
Reported display outputs
1x DVI, 1x HDMI 1.4a, 2x mini-DisplayPort 1.2*
Theoretical pixel fill rate
25.60 GPixel/s*
External power connectors
2x 6-pin*
Reported chip die area
352 mm²*
Chip foundry
TSMC*
Process node declaration
28 nm*
Transistors
4,313 million*
Graphics processor
Tahiti*
Reported video memory
3* GB
Rated memory bandwidth
240.0 GB/s*
Video memory type
GDDR5*
Raster output units
32*
Reported shading units
1,792*
Card or module format
Dual-slot*
Suggested system PSU
550 W*
2:4 tensor sparsity
No*
Declared GPU TDP
200 W*
Theoretical texture fill rate
89.60 GTexel/s*
Texture mapping units
112*
GPU cores
1,792*
Video memory
3* GB
Video memory type
GDDR5*

* Provisional data