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GPU
AMD

AMD FirePro RG220A

Graphics processor

Memory bus
256 bit*
Rated memory bandwidth
51.20 GB/s*

No matched benchmark results are available for this entry yet.

Processing & platform

Architecture
TeraScale*
Process node
55 nm*
GPU cores
80*
Reported GPU frequency
500 MHz*
Graphics interface
PCIe 2.0 x16*
Video memory
512 MB*
Reported chip die area
73 mm²*
Chip/package TDP
35 W*
Transistors
242 million*
Graphics processor
RV711*
Texture mapping units
8*
Raster output units
4*
Chip foundry
TSMC*
Card or module format
Single-slot*
Declared GPU TDP
35 W*
Suggested system PSU
200 W*
External power connectors
None*
DirectX / feature level
10.1 (10_1)*
OpenGL
3.3*
OpenCL
1.1*
Shader model
4.1*

Memory & storage

Memory options
512*
Video memory type
GDDR3*
Memory bus
256 bit*
Rated memory bandwidth
51.20 GB/s*

Power specifications

Thermal design power
35 W*

System configuration

Detailed specifications

Specifications 1 · 11 fields
Foundry
TSMC*
Vendor
AMD*
FP32 GFLOPS
80* GFLOPS
Product
AMD FirePro RG220A*
Type
GPU*
Release Date
2010-05-01*
Process Size (nm)
55* nm
TDP (W)
35* W
Die Size (mm^2)
73* mm²
Transistors (million)
242*
Freq (MHz)
500* MHz
Specifications 2 · 22 fields
proc transistors
242 million*
proc die size
73* mm²
cores
80*
memory clock
800*
ram
512*
name
AMD FirePro RG220A*
ram type
GDDR3*
bus width
256*
bus interface
PCIe 2.0 x16*
ram bandwidth
51.2* GB/s
fp32 performance
0.08*
tdp
35* W
suggested psu
200* W
slot width
Single-slot*
is retail board
No*
gpi value
0.59*
vendor
amd*
manufacturer
AMD*
arch name
TeraScale*
card release date
2010-05-04*
proc foundry
TSMC*
proc process size
55* nm
Specifications 3 · 31 fields
DirectX / feature level
10.1 (10_1)*
OpenCL
1.1*
OpenGL
3.3*
Shader model
4.1*
Architecture
TeraScale*
Graphics interface
PCIe 2.0 x16*
Memory bus
256* bit
Reported shader processors
80*
Reported theoretical FP32 peak
0.08* TFLOPS
Scope and conditions
Arithmetic density
Not stated*
Reported display outputs
1x DVI*
Theoretical pixel fill rate
2.000 GPixel/s*
External power connectors
None*
Reported chip die area
73 mm²*
Chip foundry
TSMC*
Process node declaration
55 nm*
Transistors
242 million*
Graphics processor
RV711*
Reported video memory
512* MB
Rated memory bandwidth
51.20 GB/s*
Video memory type
GDDR3*
Raster output units
4*
Reported shading units
80*
Card or module format
Single-slot*
Suggested system PSU
200 W*
2:4 tensor sparsity
No*
Declared GPU TDP
35 W*
Theoretical texture fill rate
4.000 GTexel/s*
Texture mapping units
8*
GPU cores
80*
Video memory
512* MB
Video memory type
GDDR3*

* Provisional data