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GPUAMD FirePro A320
Graphics processor
No matched benchmark results are available for this entry yet.
Processing & platform
- Architecture
- TeraScale 3*
- Process node
- 32 nm*
- GPU cores
- 384*
- Reported GPU frequency
- 800 MHz*
- Graphics interface
- PCIe 2.0 x16*
- Reported chip die area
- 246 mm²*
- Chip/package TDP
- 100 W*
- Transistors
- 1,303 million*
- Graphics processor
- Devastator*
- Texture mapping units
- 24*
- Raster output units
- 8*
- Chip foundry
- GlobalFoundries*
- Card or module format
- IGP*
- Declared GPU TDP
- 100 W*
- DirectX / feature level
- 11.2 (11_0)*
- OpenGL
- 4.4*
- OpenCL
- 1.2*
- Shader model
- 5.0*
Memory & storage
- Video memory type
- System Shared*
Power specifications
- Thermal design power
- 100 W*
System configuration
Detailed specifications
Specifications 1 · 11 fields
- Foundry
- TSMC*
- Vendor
- AMD*
- FP32 GFLOPS
- 733.4* GFLOPS
- Product
- AMD FirePro A320*
- Type
- GPU*
- Release Date
- 2012-06-06*
- Process Size (nm)
- 32* nm
- TDP (W)
- 100* W
- Die Size (mm^2)
- 246* mm²
- Transistors (million)
- 1,303*
- Freq (MHz)
- 800* MHz
Specifications 2 · 19 fields
- proc transistors
- 1,303 million*
- proc die size
- 246* mm²
- cores
- 384*
- base clock
- 800*
- boost clock
- 955*
- name
- AMD FirePro A320*
- ram type
- System Shared*
- bus interface
- PCIe 2.0 x16*
- ram bandwidth
- System Dependent*
- fp32 performance
- 0.7334*
- tdp
- 100* W
- slot width
- IGP*
- is retail board
- No*
- vendor
- amd*
- manufacturer
- AMD*
- arch name
- TeraScale 3*
- card release date
- 2012-06-06*
- proc foundry
- GlobalFoundries*
- proc process size
- 32* nm
Specifications 3 · 26 fields
- DirectX / feature level
- 11.2 (11_0)*
- OpenCL
- 1.2*
- OpenGL
- 4.4*
- Shader model
- 5.0*
- Architecture
- TeraScale 3*
- Graphics interface
- PCIe 2.0 x16*
- Reported shader processors
- 384*
- Reported theoretical FP32 peak
- 0.7334* TFLOPS
Scope and conditions
- Arithmetic density
- Not stated*
- Reported display outputs
- Motherboard Dependent*
- Theoretical pixel fill rate
- 7.640 GPixel/s*
- Reported chip die area
- 246 mm²*
- Chip foundry
- GlobalFoundries*
- Process node declaration
- 32 nm*
- Transistors
- 1,303 million*
- Graphics processor
- Devastator*
- Rated memory bandwidth
- System Dependent*
- Video memory type
- System Shared*
- Raster output units
- 8*
- Reported shading units
- 384*
- Card or module format
- IGP*
- 2:4 tensor sparsity
- No*
- Declared GPU TDP
- 100 W*
- Theoretical texture fill rate
- 22.92 GTexel/s*
- Texture mapping units
- 24*
- GPU cores
- 384*
- Video memory type
- System Shared*
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* Provisional data