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CPU

Unspecified

Xeon MP 7030 Dual-Core

Processor

CPU cores: 2^*
CPU threads: 2^*
Thermal design power: 135 W^*

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 2^*
CPU threads: 2^*
Base clock: Reported value 1: 2.8 GHz^*
Reported value 2: 2.833 GHz^*
CPU reference clock: Reported value 1: 166 MHz^*
Reported value 2: 200 MHz^*
Reported CPU clock: Reported value 1: 2.833 GHz^*
Reported value 2: 2.8 GHz^*
Socket / package: Intel Socket 604^*
Process node: 90 nm^*
Reported chip die area: 213 mm²^*
Chip/package TDP: 135 W^*
Transistors: 200 million^*

Power specifications

Thermal design power: 135 W^*

System configuration

Detailed specifications

Specifications 1 · 16 fields

Release: Dec 1st, 2005^*
Release: Dec 1st, 2005^*
Name: Xeon MP 7030 Dual-Core^*
Name: Xeon MP 7030 Dual-Core^*
Codename: Paxville^*
Codename: Paxville^*
Cores: 2^*
Cores: 2^*
Clock: 2.8^* GHz
Clock: 2.833^* GHz
Socket: Socket 604^*
Socket: Socket 604^*
Process: 90^* nm
Process: 90^* nm
TDP: 135^* W
TDP: 135^* W

Specifications 2 · 50 fields

name: Xeon MP 7030 Dual-Core^*
name: Xeon MP 7030 Dual-Core^*
Release Date: Dec 1st, 2005^*
Release Date: Dec 1st, 2005^*
Frequency: 2.8^* GHz
Frequency: 2.833^* GHz
Base Clock: 166^* MHz
Base Clock: 200^* MHz
Multiplier: 17.0x^*
Multiplier: 14.0x^*
Multiplier Unlocked: No^*
Multiplier Unlocked: No^*
Voltage: 1.412^* V
Voltage: 1.412^* V
Codename: Paxville^*
Codename: Paxville^*
Socket: Intel Socket 604^*
Socket: Intel Socket 604^*
Generation: Xeon (Paxville DP)^*
Generation: Xeon MP (Paxville MP)^*
ECC Memory: Yes^*
ECC Memory: Yes^*
# of Cores: 2^*
# of Cores: 2^*
# of Threads: 2^*
# of Threads: 2^*
SMP # CPUs: 2^*
SMP # CPUs: 2^*
Cache L1: 16^* KB
Cache L1: 16^* KB
Cache L2: 1^* MB
Cache L2: 1^* MB
Features: MMX, SSE1, SSE2, SSE3, NX-Bit, EIST, Intel 64^*
Features: MMX, SSE1, SSE2, SSE3, NX-Bit, EIST, Intel 64^*
Foundry: Intel^*
Foundry: Intel^*
Memory Bus: Dual-channel^*
Memory Bus: Dual-channel^*
Process Size: 90^* nm
Process Size: 90^* nm
Transistors: 200 million^*
Transistors: 200 million^*
Die Size: 213^* mm²
Die Size: 213^* mm²
Package: µPGA^*
Package: µPGA^*
Market: Server/Workstation^*
Market: Server/Workstation^*
Production Status: End-of-life^*
Production Status: End-of-life^*

Specifications 3 · 20 fields

Foundry: Intel^*
Foundry: Intel^*
Vendor: Intel^*
Vendor: Intel^*
Product: Intel Xeon MP 7030 Dual-Core^*
Product: Intel Xeon MP 7030 Dual-Core^*
Type: CPU^*
Type: CPU^*
Release Date: 2005-12-01^*
Release Date: 2005-12-01^*
Process Size (nm): 90^* nm
Process Size (nm): 90^* nm
TDP (W): 135^* W
TDP (W): 135^* W
Die Size (mm^2): 213^* mm²
Die Size (mm^2): 213^* mm²
Transistors (million): 200^*
Transistors (million): 200^*
Freq (MHz): 2,833^* MHz
Freq (MHz): 2,800^* MHz

* Provisional data