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SoCThomson EF6803CMG/B
System on a chip
- CPU cores
- 1*
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU cores
- 1*
System configuration
Detailed specifications
Specifications · 31 fields
- Bus clock declaration
- 1* MHz
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Architecture declaration
- 8*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Component type
- MCU*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Clock multiplier
- 1*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Technical notes
- NFC 96883 – Class G*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Declared processor cores
- 1*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Die size declaration
- 5.4 x 9.2 mm^2*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Family
- 6801/6803*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Floating-point unit declaration
- No*
Scope and conditions
- FPU implementation
- Integrated or external scope unspecified*
- Package
- Side-brazed CDIP-40*
- Maximum or typical clock declaration
- 1* MHz
Scope and conditions
- Clock type
- Maximum or typical; base or boost role unspecified*
- Package
- Side-brazed CDIP-40*
- Instruction-set architecture
- 6800*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- L1 data cache declaration
- No*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- L1 instruction cache declaration
- No*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Unified L1 cache declaration
- No*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- L2 cache declaration
- No*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- L3 cache declaration
- No*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Manufacturer
- Thomson*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- On-chip peripherals
- Clock generator*
- timer*
- serial*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Package
- Side-brazed CDIP-40*
- Part number
- EF6803CMG/B*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Maximum power declaration
- 1.5* W
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Fabrication technology
- HCMOS*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- On-chip RAM declaration
- 128* B
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Maximum RAM declaration
- 64* KiB
Scope and conditions
- Package
- Side-brazed CDIP-40*
- On-chip ROM declaration
- 2* KiB
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Socket or package footprint
- DIP-40*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Temperature range declaration
- -55* – 125* °C
Scope and conditions
- Temperature reference
- Unspecified*
- Package
- Side-brazed CDIP-40*
- Transistor count declaration
- 190,000*
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Core supply voltage range
- 4.75* – 5.25* V
Scope and conditions
- Package
- Side-brazed CDIP-40*
- Typical core supply voltage
- 5* V
Scope and conditions
- Package
- Side-brazed CDIP-40*
- I/O supply voltage
- 5* V
Scope and conditions
- Package
- Side-brazed CDIP-40*
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* Provisional data