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CPUPowerPC e600
Processor
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System configuration
Detailed specifications
Specifications · 9 fields
- Core architecture
- Designer
- Freescale*
- Architecture
- 32-bit PowerPC*
- Execution
- Superscalar out-of-order RISC*
- L1 instruction
- 32* KB
- L1 data
- 32* KB
- Pipeline stages
- 7*
- Issue width
- 3*
- AltiVec width
- 128* bit
- FPU
- Double precision*
- Backward-compatible lineage
- PowerPC 74xx*
- MPC7448 processor configuration
- Processor model
- MPC7448*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 58.44* mm²
- Cores
- 1*
- Clock options
- 1,000* – 1,700* MHz
- L2 cache
- Banks
- 1*
- Capacity per bank
- 1,024* kB
- Package options
- Pins
- 360*
- Type
- CBGA*
- Pins
- 360*
- Type
- CLGA*
- Introduced
- Year
- 2,005*
- Date precision
- Year*
- Transistors
- 90* million
- MPC8610 processor configuration
- Processor model
- MPC8610*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 82.45* mm²
- Cores
- 1*
- Clock options
- 667* – 1,333* MHz
- L2 cache
- Banks
- 1*
- Capacity per bank
- 256* kB
- Package options
- Pins
- 783*
- Type
- PBGA*
- MPC8640 processor configuration
- Processor model
- MPC8640*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 177.87* mm²
- Cores
- 1*
- Clock options
- 1,000* – 1,250* MHz
- L2 cache
- Banks
- 1*
- Capacity per bank
- 1,024* kB
- Package options
- Pins
- 1,023*
- Type
- CBGA*
- Introduced
- Year
- 2,008*
- Date precision
- Year*
- Transistors
- 225* million
- MPC8640D processor configuration
- Processor model
- MPC8640D*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 177.87* mm²
- Cores
- 2*
- Clock options
- 1,000* – 1,250* MHz
- L2 cache
- Banks
- 2*
- Capacity per bank
- 1,024* kB
- Package options
- Pins
- 1,023*
- Type
- CBGA*
- Introduced
- Year
- 2,008*
- Date precision
- Year*
- Transistors
- 225* million
- MPC8641 processor configuration
- Processor model
- MPC8641*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 177.87* mm²
- Cores
- 1*
- Clock options
- 1,000* – 1,500* MHz
- L2 cache
- Banks
- 1*
- Capacity per bank
- 1,024* kB
- Package options
- Pins
- 1,023*
- Type
- CBGA*
- Introduced
- Year
- 2,007*
- Date precision
- Year*
- Transistors
- 225* million
- MPC8641D processor configuration
- Processor model
- MPC8641D*
- Process
- 90* nm
- Process technology
- SOI*
- Die area
- 177.87* mm²
- Cores
- 2*
- Clock options
- 1,000* – 1,500* MHz
- L2 cache
- Banks
- 2*
- Capacity per bank
- 1,024* kB
- Package options
- Pins
- 1,023*
- Type
- CBGA*
- Introduced
- Year
- 2,007*
- Date precision
- Year*
- Transistors
- 225* million
- MPC8641/D memory and I/O
- PCI Express links
- 2*
- Lanes per PCI Express link
- 8*
- Memory controllers
- 2*
- Controller width
- 64* bit
- Memory type
- DDR2*
- ECC
- Yes*
- Interconnect
- RapidIO*
- Gigabit Ethernet controllers
- 4*
- MPC8641 family power points
- Model
- MPC8641*
- Clock
- 1.33* GHz
- Reported power
- Less than 16 W*
- Model
- MPC8641D*
- Clock
- 1.5* GHz
- Reported power
- Less than 25 W*
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* Provisional data