IBM PowerPC 603

Processor

CPU cores: 1^*

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 1^*
Hardware threads per core: 1^*

System configuration

Detailed specifications

Specifications · 46 fields

metal layers Manufacturing process: 4^*
date: 1995-02-01^*
date: 1993-09-01^*
clock: 66^*
clock: 80^*
hw nthreadspercore: 1^*
hw nthreadspercore: 1^*
hw ncores: 1^*
hw ncores: 1^*
tdp: 3^*
tdp: 2.2^*
bus width: 32^*
bus width: 32^*
transistors: 1.6^*
transistors: 1.6^*
die size: 85^*
die size: 83^*
vdd low: 3.3^*
vdd low: 3.3^*
vdd high: 3.3^*
vdd high: 3.3^*
fanout Process gate-delay observation: 1^*
fanout Process gate-delay observation: 1^*
fanout Process gate-delay observation: 1^*
fanout Process gate-delay observation: 6.5^*
l1i CPU cache configuration: 8^*
name Processor family: PowerPC 603^*
delay Process gate-delay observation: 90^*
delay Process gate-delay observation: 660^*
delay Process gate-delay observation: 125^*
delay Process gate-delay observation: 80^*
l1d CPU cache configuration: 8^*
l2 shared CPU cache configuration: 256^*
name Manufacturing process: CMOS-5X^*
vdd Process gate-delay observation: 3.3^*
vdd Process gate-delay observation: 4^*
vdd Process gate-delay observation: 2.5^*
vdd Process gate-delay observation: 3.3^*
gate type Process gate-delay observation: nand2^*
gate type Process gate-delay observation: inv^*
gate type Process gate-delay observation: inv^*
gate type Process gate-delay observation: inv^*
year Manufacturing process: 1994^*
technology Manufacturing process: CMOS^*
feature size Manufacturing process: 0.5^*
channel length Manufacturing process: 0.45^*

* Provisional data

Processing & platform

System configuration

Detailed specifications

Devices using this component