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CPU
Unspecified

EPYC 7303P

Processor

CPU cores
16*
CPU threads
32*
Maximum boost clock
3.4 GHz*
Thermal design power
130 W*

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores
16*
CPU threads
32*
Base clock
2.4 GHz*
CPU reference clock
100 MHz*
Maximum boost clock
3.4 GHz*
L3 cache
64 MB*
Socket / package
AMD Socket SP3*

Memory & storage

Rated memory bandwidth
204.80 GB/s*

Power specifications

Thermal design power
130 W*

System configuration

Detailed specifications

Specifications 1 · 11 fields
Maximum turbo frequency
3.4* GHz
Scope and conditions
native_context
Clock scope
Maximum turbo declaration; not measured or sustained all-core frequency*
Codename
Milan*
Processor model
EPYC 7303P*
Full processor designation
AMD EPYC 7303P 16-Core Processor*
Processor family
AMD EPYC*
Launch year
precision
year*
text
2023*
Declared memory capacity
4* TB
Scope and conditions
native_context
Capacity unit base
Not independently established*
CPU cores
16*
L3 cache
64* MB
Scope and conditions
native_context
Capacity unit base
Not independently established*
Thermal design power declaration
130* W
CPU threads
32*
Specifications 2 · 37 fields
name
EPYC 7303P*
Release Date
Sep 5th, 2023*
Part#
100-000001289 100-100001289WOF*
Frequency
2.4* GHz
Turbo Clock
up to 3.4 GHz*
I/O Process Size
12* nm
I/O Die Size
416* mm²
Base Clock
100* MHz
Multiplier
24.0x*
Multiplier Unlocked
No*
# of CCDs
2*
Cores per CCD
8*
Codename
Milan*
Socket
AMD Socket SP3*
Generation
EPYC (Zen 3 (Milan))*
Memory Support
DDR4*
ECC Memory
Yes*
# of Cores
16*
# of Threads
32*
SMP # CPUs
1*
Cache L1
64 KB (per core)*
Cache L2
512 KB (per core)*
Features
MMX, EMMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, AVX, AVX2, ABM, BMI1, BMI2, FMA3, AES, RdRand, SHA, ADX, CLMUL, F16C, Real, Protected, SMM, FPU, NX bit, SMT, AMD-Vi, AMD-V, SME, TSME, SEV, SenseMi, Boost 2*
Foundry
TSMC*
Rated Speed
3,200* MT/s
Memory Bus
Eight-channel*
Memory Bandwidth
204.8* GB/s
Launch Price
$594*
PCI-Express
Gen 4, 128 Lanes (CPU only)*
Process Size
7* nm
Cache L3
64 MB (shared)*
Configurable TDP
120-150 W*
Transistors
8,300 million*
Die Size
2x 81 mm²*
Package
FCLGA-4094*
Market
Server/Workstation*
Production Status
Active*

* Provisional data