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SoCBLX IC Design GSC3280
System on a chip
- CPU cores
- 1*
- Process node
- 130 nm*
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU cores
- 1*
- Process node
- 130 nm*
System configuration
Detailed specifications
Specifications · 30 fields
- Address bus declaration
- 14*
Scope and conditions
- Package
- LFBGA-256*
- Architecture declaration
- 32*
Scope and conditions
- Package
- LFBGA-256*
- Bus bandwidth declaration
- 16x600Mbps*
Scope and conditions
- Package
- LFBGA-256*
- Component type
- SoC*
Scope and conditions
- Package
- LFBGA-256*
- Clone designation
- no*
Scope and conditions
- Package
- LFBGA-256*
- Core design
- Godson*
Scope and conditions
- Package
- LFBGA-256*
- Declared processor cores
- 1*
Scope and conditions
- Package
- LFBGA-256*
- Core designer
- BLX IC Design*
Scope and conditions
- Package
- LFBGA-256*
- Family
- Godson*
Scope and conditions
- Package
- LFBGA-256*
- Maximum or typical clock declaration
- 200* – 300* MHz
Scope and conditions
- Package
- LFBGA-256*
- Instruction-set architecture
- MIPS*
Scope and conditions
- Package
- LFBGA-256*
- L1 data cache declaration
- 16* KiB
Scope and conditions
- Package
- LFBGA-256*
- L1 instruction cache declaration
- 16* KiB
Scope and conditions
- Package
- LFBGA-256*
- Manufacturer
- BLX IC Design*
Scope and conditions
- Package
- LFBGA-256*
- On-chip peripherals
- PLL clock generator*
- ADC*
- WDT*
- Ethernet MAC controller*
- USB2.0 OTG controller*
- DDR2 controller*
- NAND Flash controller*
- SD / SDIO host controller*
- LCD controller*
- I2C*
- I2S*
- UART*
- SPI*
- CAN*
- PS2*
- PWM*
- rotary encoder phase detectors*
- timers*
- JTAG*
Scope and conditions
- Package
- LFBGA-256*
- Package
- LFBGA-256*
- Package dimensions
- 15 x 15 mm^2*
Scope and conditions
- Package
- LFBGA-256*
- Part number
- GSC3280*
Scope and conditions
- Package
- LFBGA-256*
- Pipeline declaration
- 7-stage*
Scope and conditions
- Package
- LFBGA-256*
- Fabrication node declaration
- 0.13* µm
Scope and conditions
- Package
- LFBGA-256*
- Fabrication technology
- CMOS*
Scope and conditions
- Package
- LFBGA-256*
- Maximum RAM declaration
- 256* MiB
Scope and conditions
- Package
- LFBGA-256*
- RAM type
- DDR2*
Scope and conditions
- Package
- LFBGA-256*
- Subfamily
- GSC3280*
Scope and conditions
- Package
- LFBGA-256*
- Temperature grade
- Industrial*
Scope and conditions
- Package
- LFBGA-256*
- Temperature range declaration
- -40* – 85* °C
Scope and conditions
- Temperature reference
- Unspecified*
- Package
- LFBGA-256*
- Typical core supply voltage
- 1.2* V
Scope and conditions
- Package
- LFBGA-256*
- I/O supply voltage
- 3.3* V
Scope and conditions
- Package
- LFBGA-256*
- Secondary supply voltage
- 1.8* V
Scope and conditions
- Condition
- (DDR2 RAM)*
- Package
- LFBGA-256*
- Tertiary supply voltage
- 3.3* V
Scope and conditions
- Package
- LFBGA-256*
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* Provisional data