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CPUAMD Ryzen Embedded 5900E
Processor Released
- CPU cores
- 12
- CPU threads
- 24
- Maximum boost clock
- 3.7 GHz
- Thermal design power
- 105 W
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU cores
- 12
- CPU threads
- 24
- Base clock
- 3.35 GHz
- CPU reference clock
- 100 MHz*
- Maximum boost clock
- 3.7 GHz
- L3 cache
- 64 MB
- L2 cache
- 6 MB
- Architecture
- Zen 3
- Socket / package
- AM4
Cache hierarchy
- L3 / total
- Level
- L3
- Scope
- total
- Size
- 64 MB
Memory & storage
- Memory channels
- 2
- Rated memory bandwidth
- 51.20 GB/s*
CPU memory support
- DDR4
- Variant / details
- Up to 3200 MT/s
- Technology
- DDR4
- Transfer rate
- 3,200 MT/s
- Memory controller
- Variant / details
- Dual Channel w/ECC
Power specifications
- Thermal design power
- 105 W
System configuration
Detailed specifications
Specifications · 35 fields
- name
- Ryzen Embedded 5900E*
- Release Date
- Apr 20th, 2023*
- Part#
- 100-000000731*
- Frequency
- 3.35* GHz
- Turbo Clock
- up to 3.7 GHz*
- I/O Process Size
- 12* nm
- I/O Die Size
- 125* mm²
- Base Clock
- 100* MHz
- Multiplier
- 33.5x*
- Multiplier Unlocked
- No*
- Codename
- Vermeer*
- Socket
- AMD Socket AM4*
- Generation
- Ryzen Embedded (Zen 3 (Vermeer))*
- Memory Support
- DDR4*
- ECC Memory
- Yes*
- # of Cores
- 12*
- # of Threads
- 24*
- SMP # CPUs
- 1*
- Cache L1
- 64 KB (per core)*
- Cache L2
- 512 KB (per core)*
- Features
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES, AVX, AVX2, BMI1, BMI2, SHA, F16C, FMA3, AMD64, EVP, AMD-V, SMAP, SMEP, SMT, Precision Boost 2*
- Foundry
- TSMC*
- Rated Speed
- 3,200* MT/s
- Memory Bus
- Dual-channel*
- Memory Bandwidth
- 51.2* GB/s
- tJMax
- 105°C*
- PCI-Express
- Gen 4, 24 Lanes (CPU only)*
- Process Size
- 7* nm
- Cache L3
- 64 MB (shared)*
- Chipset
- AMD 500 Series*
- Transistors
- 8,300 million*
- Die Size
- 2x 74 mm²*
- Package
- µOPGA-1331*
- Market
- Desktop*
- Production Status
- Active*
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* Provisional data