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CPUAMD Ryzen AI MAX+ 392
Processor
- CPU cores
- 12
- CPU threads
- 24
- Maximum boost clock
- 5 GHz
- Thermal design power
- 55 W
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Processing & platform
- CPU cores
- 12
- Graphics
- CPU threads
- 24
- Base clock
- 3.2 GHz
- Reported integrated GPU frequency
- 2,900 MHz*
- Maximum boost clock
- 5 GHz
- L3 cache
- 64 MB
- L2 cache
- 12 MB
- Architecture
- Zen 5
- Socket / package
- FP11
- Manufacturing process
- TSMC 4nm FinFET
- Process node
- 4 nm
Cache hierarchy
- L3 / total
- Level
- L3
- Scope
- total
- Size
- 64 MB
Memory & storage
Supported memory
- LPDDR5X-256
- Technology
- LPDDR5X
- Transfer rate
- 256 MT/s
- 256-bit LPDDR5x*
CPU memory support
- 256-bit LPDDR5X
- Memory interface width
- 256 bit
- Technology
- LPDDR5X
Power specifications
- Thermal design power
- 55 W
CPU power specifications
- Configurable TDP 45–120 W
- Maximum rating
- 120 W
- Minimum rating
- 45 W
- Power specification
- Configurable TDP
- Variant / details
- 45-120W
- AMD configurable TDP*
- Power specification
- cTDP*
- Minimum rating
- 45 W*
- Maximum rating
- 120 W*
System configuration
Detailed specifications
Specifications · 23 fields
- Name
- AMD Ryzen™ AI Max+ 392*
- L3 Cache
- 64* MB
- Default TDP
- 55* W
- AMD Configurable TDP (cTDP)
- 45-120W*
- Processor Technology for CPU Cores
- TSMC 4nm FinFET*
- CPU Socket
- FP11*
- Family
- Ryzen*
- Max. Operating Temperature (Tjmax)
- 100* °C
- *OS Support
- Windows 11 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit*
- PCI Express® Version
- PCIe® 4.0*
- System Memory Type
- 256-bit LPDDR5x*
- Graphics Model
- Radeon 8060S Graphics*
- Graphics Core Count
- 40*
- Graphics Frequency
- 2,900* MHz
- Series
- Ryzen AI Max 300 Series*
- AMD Ryzen™ AI
- Available*
- Product ID Tray
- 100-000001979*
- Form Factor
- Laptops, Desktops*
- # of CPU Cores
- 12*
- # of Threads
- 24*
- Max. Boost Clock
- 5.0* GHz
Scope and conditions
- source_native_row_context
- Qualification
- Up to*
- Original declaration
- Up to 5 GHz*
- Base Clock
- 3.2* GHz
- L2 Cache
- 12* MB
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* Provisional data