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CPUAMD Ryzen 9 9850HX
Processor
- CPU cores
- 12
- CPU threads
- 24
- Maximum boost clock
- 5.2 GHz
- Thermal design power
- 55 W
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU cores
- 12
- Graphics
- CPU threads
- 24
- Base clock
- 3 GHz
- CPU reference clock
- 100 MHz*
- Reported integrated GPU frequency
- 2,200 MHz*
- L1 cache
- 960 KB*
- Maximum boost clock
- 5.2 GHz
- L3 cache
- 64 MB
- L2 cache
- 12 MB
- Socket / package
- FL1
- Manufacturing process
- TSMC 4nm FinFET
- Process node
- 4 nm
Cache hierarchy
- L3 / total
- Level
- L3
- Scope
- total
- Size
- 64 MB
Memory & storage
- Memory channels
- 2
- Rated memory bandwidth
- 89.60 GB/s*
Supported memory
- DDR5*
CPU memory support
- DDR5
- Technology
- DDR5
Power specifications
- Thermal design power
- 55 W
CPU power specifications
- Configurable TDP 55–75 W
- Maximum rating
- 75 W
- Minimum rating
- 55 W
- Power specification
- Configurable TDP
- Variant / details
- 55-75W
- AMD configurable TDP*
- Power specification
- cTDP*
- Minimum rating
- 45 W*
- Maximum rating
- 75 W*
System configuration
Detailed specifications
Specifications 1 · 25 fields
- Name
- AMD Ryzen™ 9 9850HX*
- L3 Cache
- 64* MB
- Default TDP
- 55* W
- L1 Cache
- 960* KB
- AMD Configurable TDP (cTDP)
- 45-75W*
- Processor Technology for CPU Cores
- TSMC 4nm FinFET*
- Unlocked for Overclocking
- Yes*
- CPU Socket
- FL1*
- Family
- Ryzen*
- Max. Operating Temperature (Tjmax)
- 100* °C
- *OS Support
- Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit*
- PCI Express® Version
- PCIe® 5.0*
- System Memory Type
- DDR5*
- Memory Channels
- 2*
- Graphics Model
- AMD Radeon™ 610M*
- Graphics Core Count
- 2*
- Graphics Frequency
- 2,200* MHz
- Series
- Ryzen 9000 Series*
- Product ID Tray
- 100-000001366*
- Form Factor
- Laptops, Desktops*
- # of CPU Cores
- 12*
- # of Threads
- 24*
- Max. Boost Clock
- 5.2* GHz
Scope and conditions
- source_native_row_context
- Qualification
- Up to*
- Original declaration
- Up to 5.2 GHz*
- Base Clock
- 3* GHz
- L2 Cache
- 12* MB
Specifications 2 · 38 fields
- name
- Ryzen 9 9850HX*
- Release Date
- Jan 6th, 2025*
- Part#
- 100-000001366*
- Frequency
- 3* GHz
- Turbo Clock
- up to 5.2 GHz*
- I/O Process Size
- 6* nm
- I/O Die Size
- 122* mm²
- Base Clock
- 100* MHz
- Multiplier
- 30.0x*
- Multiplier Unlocked
- Yes*
- I/O Transistors
- 3,400 million*
- PPT
- 61-101 W*
- Codename
- Fire Range*
- Socket
- AMD Socket FL1*
- Generation
- Ryzen 9 (Zen 5 (Fire Range))*
- Memory Support
- DDR5*
- ECC Memory
- Yes*
- # of Cores
- 12*
- # of Threads
- 24*
- SMP # CPUs
- 1*
- Integrated Graphics
- Radeon 610M*
- Cache L1
- 80 KB (per core)*
- Cache L2
- 1 MB (per core)*
- Features
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES, AVX, AVX2, AVX-512, BMI1, BMI2, SHA, F16C, FMA3, AMD64, EVP, AMD-V, SMAP, SMEP, SMT, Precision Boost OD, Precision Boost 2, AMD EXPO*
- Foundry
- TSMC*
- Rated Speed
- 5,600* MT/s
- Memory Bus
- Dual-channel*
- Memory Bandwidth
- 89.6* GB/s
- tJMax
- 100°C*
- PCI-Express
- Gen 5, 28 Lanes (CPU only)*
- Process Size
- 4* nm
- Cache L3
- 64 MB (shared)*
- Configurable TDP
- 45-75 W*
- Transistors
- 16,630 million*
- Die Size
- 2x 70.6 mm²*
- Package
- µFC-BGAFL1*
- Market
- Mobile*
- Production Status
- Active*
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* Provisional data