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CPU

AMD

AMD Ryzen 7 8840HX

Processor Released Apr 23, 2025

CPU cores: 12
CPU threads: 24
Maximum boost clock: 5.1 GHz
Thermal design power: 55 W

No matched benchmark results are available for this entry yet.

Processing & platform

CPU cores: 12
Graphics: AMD Radeon™ 610M ^*
CPU threads: 24
Base clock: 2.9 GHz
CPU reference clock: 100 MHz^*
Reported integrated GPU frequency: 2,200 MHz^*
L1 cache: 768 KB^*
Maximum boost clock: 5.1 GHz
L3 cache: 64 MB
L2 cache: 12 MB
Architecture: Zen 4
Socket / package: FL1
Manufacturing process: TSMC 5nm FinFET
Process node: 5 nm

Cache hierarchy

L3 / total
Level
L3
Scope
total
Size
64 MB

Memory & storage

Memory channels: 2
Rated memory bandwidth: 83.20 GB/s^*

Supported memory

DDR5^*

CPU memory support

DDR5
Technology
DDR5

Power specifications

Thermal design power: 55 W

CPU power specifications

Configurable TDP 45–75 W
Maximum rating
75 W
Minimum rating
45 W
Power specification
Configurable TDP
Variant / details
45-75W
AMD configurable TDP^*
Power specification
cTDP^*
Minimum rating
45 W^*
Maximum rating
75 W^*

System configuration

Detailed specifications

Specifications 1 · 26 fields

Name

AMD Ryzen™ 7 8840HX^*

L3 Cache

64^* MB

Default TDP

55^* W

L1 Cache

768^* KB

AMD Configurable TDP (cTDP)

45-75W^*

Processor Technology for CPU Cores

TSMC 5nm FinFET^*

Unlocked for Overclocking

Yes^*

CPU Socket

FL1^*

Family

Ryzen^*

Max. Operating Temperature (Tjmax)

100^* °C

Launch Date

4/23/25^*

*OS Support

Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit^*

PCI Express® Version

PCIe® 5.0^*

System Memory Type

DDR5^*

Memory Channels

2^*

Graphics Model

AMD Radeon™ 610M^*

Graphics Core Count

2^*

Graphics Frequency

2,200^* MHz

Series

Ryzen 8000 Series^*

Product ID Tray

100-000001850^*

Form Factor

Laptops, Desktops^*

# of CPU Cores

12^*

# of Threads

24^*

Max. Boost Clock

5.1^* GHz

Scope and conditions

source_native_row_context

Qualification: Up to^*
Original declaration: Up to 5.1 GHz^*

Base Clock

2.9^* GHz

L2 Cache

12^* MB

Specifications 2 · 36 fields

name: Ryzen 7 8840HX^*
Release Date: Apr 23rd, 2025^*
Part#: 100-000001850^*
Frequency: 2.9^* GHz
Turbo Clock: up to 5.1 GHz^*
I/O Process Size: 6^* nm
I/O Die Size: 122^* mm²
Base Clock: 100^* MHz
Multiplier: 29.0x^*
Multiplier Unlocked: Yes^*
Codename: Dragon Range^*
Socket: AMD Socket FL1^*
Generation: Ryzen 7 (Zen 4 (Dragon Range))^*
Memory Support: DDR5^*
ECC Memory: No^*
# of Cores: 12^*
# of Threads: 24^*
SMP # CPUs: 1^*
Integrated Graphics: Radeon 610M^*
Cache L1: 64 KB (per core)^*
Cache L2: 1 MB (per core)^*
Features: MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES, AVX, AVX2, AVX-512, BMI1, BMI2, SHA, F16C, FMA3, NX-Bit, AMD64, EVP, AMD-V, SMAP, SMEP, SMT, Precision Boost 2^*
Foundry: TSMC^*
Rated Speed: 5,200^* MT/s
Memory Bus: Dual-channel^*
Memory Bandwidth: 83.2^* GB/s
tJMax: 100°C^*
PCI-Express: Gen 5, 28 Lanes (CPU only)^*
Process Size: 5^* nm
Cache L3: 64 MB (shared)^*
Configurable TDP: 45-75 W^*
Transistors: 13,140 million^*
Die Size: 2x 71 mm²^*
Package: µFC-BGAFL1^*
Market: Mobile^*
Production Status: Active^*

* Provisional data