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CPUA6-5200
Processor
- CPU cores
- 4*
- CPU threads
- 4*
- Thermal design power
- 25 W*
No matched benchmark results are available for this entry yet.
Processing & platform
- CPU cores
- 4*
- CPU threads
- 4*
- Base clock
- 2 GHz*
- CPU reference clock
- 100 MHz*
- Socket / package
- Socket FT3*
Memory & storage
- Rated memory bandwidth
- 12.80 GB/s*
Power specifications
- Thermal design power
- 25 W*
System configuration
Detailed specifications
Specifications 1 · 8 fields
- Release
- May 23rd, 2013*
- Name
- A6-5200*
- Codename
- Kabini*
- Cores
- 4*
- Clock
- 2,000* MHz
- Socket
- Socket FT3*
- Process
- 28* nm
- TDP
- 25* W
Specifications 2 · 32 fields
- name
- A6-5200*
- Release Date
- May 23rd, 2013*
- Core Pipeline
- 16 Stages*
- Part#
- AM5200IAJ44HM*
- Frequency
- 2,000* MHz
- Base Clock
- 100* MHz
- Multiplier
- 20.0x*
- Multiplier Unlocked
- No*
- Voltage
- 1.475* V
- Codename
- Kabini*
- Socket
- AMD Socket FT3*
- Generation
- A6 (Kabini)*
- Memory Support
- DDR3*
- ECC Memory
- No*
- # of Cores
- 4*
- # of Threads
- 4*
- SMP # CPUs
- 1*
- Integrated Graphics
- Radeon HD 8400*
- Cache L1
- 64 KB (per core)*
- Cache L2
- 2 MB (shared)*
- Features
- MMX, 3DNow!, SSE, SSE2, SSE3, SSE4A, SSE4.1, SSE4.2, AVX, AES, F16C, BMI1, AMD64, CnQ, NX bit, AMD-V*
- Foundry
- GlobalFoundries*
- Rated Speed
- 1,600* MT/s
- Memory Bus
- Single-channel*
- Memory Bandwidth
- 12.8* GB/s
- PCI-Express
- Gen 2, 8 Lanes (CPU only)*
- Process Size
- 28* nm
- tCaseMax
- 90°C*
- Die Size
- 107* mm²
- Package
- BGA2*
- Market
- Mobile*
- Production Status
- End-of-life*
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* Provisional data