GeekRadar / The comparison desk
COMPARE.
CPUs
- Thermal design power
17 W*
- Socket / package
VIA nanoBGA2*
- Thermal design power
28 W*
- Socket / package
VIA nanoBGA2*
- Thermal design power
28 W*
- Socket / package
VIA nanoBGA2*
- Thermal design power
10 W*
- Socket / package
VIA nanoBGA2*
- Thermal design power
10 W*
- Socket / package
VIA nanoBGA2*
- Socket / package
VIA nanoBGA2*
- Socket / package
VIA nanoBGA2*
- Socket / package
VIA nanoBGA2*
- Socket / package
VIA nanoBGA2*
- Thermal design power
13 W*
- Socket / package
VIA nanoBGA2*
- Hardware threads per core
1*
- Hardware threads per core
1*
- Hardware threads per core
1*
- Chipset
Qualcomm MSM8929 Snapdragon 415
- Clock configuration
4 x 1.5 GHz & 4 x 1.2 GHz
- Chipset
Qualcomm MSM8917 Snapdragon 425
- Processor
8 cores up to 1.8 GHz Cortex-A53
- Chipset
Qualcomm SM6475-AB Snapdragon 6 Gen 3
- Processor
Cortex-A78 & Cortex-A55
- Clock configuration
4 x 2.4 GHz + 4 x 1.8 GHz
* Provisional data