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Type
40,286 results
CPU cores
2*
Reported CPU clock
2.7 GHz*
Thermal design power
65 W*
Architecture
Lynx*
CPU cores
2*
Reported CPU clock
2.8 GHz*
Thermal design power
65 W*
Architecture
Lynx*
CPU cores
2*
Reported CPU clock
3 GHz*
Thermal design power
65 W*
Architecture
Piledriver*
CPU cores
Reported value 1: 2*
Reported value 2: 2*
Reported value 3: 1*
CPU threads
1*
Base clock
3.2 GHz*
Maximum boost clock
3.4 GHz*
Reported CPU clock
2.5 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
35 W*
Reported CPU clock
1.9 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
17 W*
Reported CPU clock
1.5 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
15 W*
Reported CPU clock
1.5 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
15 W*
Reported CPU clock
2 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
17 W*
Reported CPU clock
2.7 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
35 W*
Reported CPU clock
3.4 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
65 W*
CPU cores
2*
Maximum boost clock
3.9 GHz*
Reported CPU clock
3.7 GHz*
Thermal design power
65 W*
CPU cores
Reported value 1: 1*
Reported value 2: 2*
CPU threads
1*
Base clock
3.8 GHz*
Maximum boost clock
4 GHz*
Reported CPU clock
1 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
8 W*
Reported CPU clock
1.4 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
35 W*
Reported CPU clock
1.6 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
45 W*
Reported CPU clock
1.5 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
35 W*
Reported CPU clock
1.7 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
45 W*
CPU cores
3*
Reported CPU clock
2.1 GHz*
Thermal design power
65 W*
Architecture
Lynx*
Reported CPU clock
2.1 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
65 W*
Reported CPU clock
2.2 GHz*
Process node
32 nm*
Reported chip die area
228 mm²*
Chip/package TDP
65 W*
CPU cores
4*
Reported CPU clock
2.6 GHz*
Thermal design power
100 W*
Architecture
Lynx*
CPU cores
4*
Reported CPU clock
2.7 GHz*
Thermal design power
100 W*
Architecture
Lynx*
Reported CPU clock
2.7 GHz*
Process node
32 nm*
Reported chip die area
246 mm²*
Chip/package TDP
35 W*

* Provisional data