- Reported CPU clock
- 3 GHz*
- Process node
- 32 nm*
- Reported chip die area
- 435 mm²*
- Chip/package TDP
- 130 W*
GeekRadar / The comparison desk
COMPARE.
CPUs- CPU cores
- 4
- CPU threads
- 8
- Base clock
- 3.3 GHz
- Maximum boost clock
- 3.7 GHz
- CPU cores
- 6
- CPU threads
- 12
- Base clock
- 2.4 GHz
- Maximum boost clock
- 4 GHz
- CPU cores
- 8
- CPU threads
- 16
- Base clock
- 3.5 GHz
- Maximum boost clock
- 5.3 GHz
- CPU cores
- 8
- CPU threads
- 16
- Base clock
- 3.5 GHz
- Maximum boost clock
- 5.3 GHz
- CPU cores
- 8
- CPU threads
- 16
- Base clock
- 1.5 GHz
- Maximum boost clock
- 4.9 GHz
- Reported CPU clock
- 1.5 GHz*
- Process node
- 65 nm*
- Reported chip die area
- 90 mm²*
- Chip/package TDP
- 27 W*
- Reported CPU clock
- 1.066 GHz*
- Process node
- 65 nm*
- Reported chip die area
- 90 mm²*
- Chip/package TDP
- 5 W*
- Reported CPU clock
- 1.2 GHz*
- Process node
- 65 nm*
- Reported chip die area
- 90 mm²*
- Chip/package TDP
- 5 W*
- Reported CPU clock
- 1.333 GHz*
- Process node
- 65 nm*
- Reported chip die area
- 90 mm²*
- Chip/package TDP
- 5 W*
- CPU cores
- 2*
- Base clock
- 1.2 GHz*
- Thermal design power
- 10 W*
- Socket / package
- PBGA479*
- Reported CPU clock
- 2.4 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 60 W*
- Reported CPU clock
- 2.667 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 66 W*
- Reported CPU clock
- 2.8 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 68 W*
- Reported CPU clock
- 3.067 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 70 W*
- Reported CPU clock
- 2.667 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 66 W*
- Reported CPU clock
- 2.8 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 68 W*
- Reported CPU clock
- 3.067 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 70 W*
- Reported CPU clock
- 3.2 GHz*
- Process node
- 130 nm*
- Reported chip die area
- 131 mm²*
- Chip/package TDP
- 76 W*
- Reported CPU clock
- 2.8 GHz*
- Process node
- 90 nm*
- Reported chip die area
- 112 mm²*
- Chip/package TDP
- 88 W*
- Reported CPU clock
- 3.067 GHz*
- Process node
- 90 nm*
- Reported chip die area
- 112 mm²*
- Chip/package TDP
- 88 W*
- Reported CPU clock
- 3.2 GHz*
- Process node
- 90 nm*
- Reported chip die area
- 112 mm²*
- Chip/package TDP
- 88 W*
- Reported CPU clock
- 3.334 GHz*
- Process node
- 90 nm*
- Reported chip die area
- 112 mm²*
- Chip/package TDP
- 88 W*
- Reported CPU clock
- 3.467 GHz*
- Process node
- 90 nm*
- Reported chip die area
- 112 mm²*
- Chip/package TDP
- 88 W*
0 selected Compare 0
* Provisional data