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Type
40,286 results
Reported CPU clock
3 GHz*
Process node
32 nm*
Reported chip die area
435 mm²*
Chip/package TDP
130 W*
CPU cores
4
CPU threads
8
Base clock
3.3 GHz
Maximum boost clock
3.7 GHz
CPU cores
6
CPU threads
12
Base clock
2.4 GHz
Maximum boost clock
4 GHz
CPU cores
8
CPU threads
16
Base clock
3.5 GHz
Maximum boost clock
5.3 GHz
CPU cores
8
CPU threads
16
Base clock
3.5 GHz
Maximum boost clock
5.3 GHz
CPU cores
8
CPU threads
16
Base clock
1.5 GHz
Maximum boost clock
4.9 GHz
Reported CPU clock
1.5 GHz*
Process node
65 nm*
Reported chip die area
90 mm²*
Chip/package TDP
27 W*
Reported CPU clock
1.066 GHz*
Process node
65 nm*
Reported chip die area
90 mm²*
Chip/package TDP
5 W*
Reported CPU clock
1.2 GHz*
Process node
65 nm*
Reported chip die area
90 mm²*
Chip/package TDP
5 W*
Reported CPU clock
1.333 GHz*
Process node
65 nm*
Reported chip die area
90 mm²*
Chip/package TDP
5 W*
Reported CPU clock
2.4 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
60 W*
Reported CPU clock
2.667 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
66 W*
Reported CPU clock
2.8 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
68 W*
Reported CPU clock
3.067 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
70 W*
Reported CPU clock
2.667 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
66 W*
Reported CPU clock
2.8 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
68 W*
Reported CPU clock
3.067 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
70 W*
Reported CPU clock
3.2 GHz*
Process node
130 nm*
Reported chip die area
131 mm²*
Chip/package TDP
76 W*
Reported CPU clock
2.8 GHz*
Process node
90 nm*
Reported chip die area
112 mm²*
Chip/package TDP
88 W*
Reported CPU clock
3.067 GHz*
Process node
90 nm*
Reported chip die area
112 mm²*
Chip/package TDP
88 W*
Reported CPU clock
3.2 GHz*
Process node
90 nm*
Reported chip die area
112 mm²*
Chip/package TDP
88 W*
Reported CPU clock
3.334 GHz*
Process node
90 nm*
Reported chip die area
112 mm²*
Chip/package TDP
88 W*
Reported CPU clock
3.467 GHz*
Process node
90 nm*
Reported chip die area
112 mm²*
Chip/package TDP
88 W*

* Provisional data