FirePro M3900

Processore grafico

Memoria video: 1 GB^*
Bus di memoria: 64 bit^*
Banda di memoria nominale: 14,40 GB/s^*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Architettura: Valore riportato 1: Caicos^*
Valore riportato 2: TeraScale 2^*
Nodo produttivo: 40 nm^*
Frequenza base GPU: 750 MHz^*
Frequenza dichiarata della memoria grafica: 900 MHz^*

Memoria e archiviazione

Memoria video: 1 GB^*
Tipo memoria video: Valore riportato 1: DDR3^*
Valore riportato 2: GDDR3^*
Valore riportato 3: GDDR3^*
Bus di memoria: 64 bit^*
Banda di memoria nominale: 14,40 GB/s^*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 17 campi

Architecture: Caicos^*
Integrated: Yes^*
L2 Cache: 0KB^*
Manufacturer: AMD^*
Max Power: 20 Watts^*
Memory Bandwidth: 14.4GB/sec^*
Memory Bus: 64 Bit^*
Memory Speed: 900^* MHz
Memory Type: DDR3^*
Name: FirePro M3900^*
Notebook GPU: Yes^*
Open GL: 4^*
Release Date: 13-Apr-2011^*
SLI Crossfire: No^*
Shader: 5^*
Dedicated: No^*
Direct X: DX 11^*

Specifiche 2 · 8 campi

Product Name: FirePro M3900^*
GPU Chip: Seymour^*
Released: Oct 19th, 2010^*
Bus: PCIe 2.0 x16^*
Memory: 1024 MB, GDDR3, 64 bit^*
GPU clock: 750^* MHz
Memory clock: 900^* MHz
Shaders TMUs ROPs: 160 / 8 / 4^*

Specifiche 3 · 8 campi

Product Name: FirePro M3900^*
GPU Chip: Seymour^*
Released: Oct 19th, 2010^*
Bus: PCIe 2.0 x16^*
Memory: 1024 MB, GDDR3, 64 bit^*
GPU clock: 750^* MHz
Memory clock: 900^* MHz
Shaders / TMUs / ROPs: 160 / 8 / 4^*

Specifiche 4 · 48 campi

Brand: AMD^*
Top BUS WIDTH: 64^* bit
Graphics Processor GPU Name: Seymour^*
Graphics Processor Architecture: TeraScale 2^*
Graphics Processor Process Size: 40^* nm
Graphics Processor Transistors: 370 million^*
Graphics Processor Die Size: 67^* mm²
Name: FirePro M3900^*
Clock Speeds GPU Clock: 750^* MHz
Clock Speeds Memory Clock: 900 MHz 1800 Mbps effective^*
Memory Memory Size: 1.024^* MB
Memory Memory Type: GDDR3^*
Memory Memory Bus: 64^* bit
Memory Bandwidth: 14,4^* GB/s
Render Config TMUs: 8^*
Top GRAPHICS PROCESSOR: Seymour^*
Render Config ROPs: 4^*
Theoretical Performance Pixel Rate: 3.000 GPixel/s
Theoretical Performance Texture Rate: 6.000 GTexel/s
Board Design TDP: 20^* W
Board Design Outputs: Portable Device Dependent^*
Graphics Features DirectX: 11.2 (11_0)^*
Graphics Features OpenGL: 4,4^*
Graphics Features OpenCL: 1,2^*
source file: amd2010.json^*
Graphics Processor Foundry: TSMC^*
Recommended Resolutions: Playable:640x480 | Unplayable:1280x720 | Unplayable:1366x768^*
Graphics Processor GPU Variant: Seymour GL^*
Graphics Processor Density: 5.5M / mm²^*
Mobile Graphics Release Date: Oct 19th, 2010^*
Top TMUS: 8^*
Mobile Graphics Generation: FirePro Mobile (Mx900)^*
Mobile Graphics Production: End-of-life^*
Mobile Graphics Bus Interface: PCIe 2.0 x16^*
Mobile Graphics Reviews: 2 in our database^*
Graphics Processor Chip Package: FCBGA-631/962^*
Top ROPS: 4^*
Mobile Graphics Successor: Radeon Pro Mobile^*
Mobile Graphics Predecessor: FirePro Mobility^*
Graphics Features Shader Model: 5.0^*
Top CORES: 160^*
Render Config Shading Units: 160^*
Render Config Compute Units: 2^*
Render Config L2 Cache: 128^* KB
Top MEMORY SIZE: 1.024^* MB
Theoretical Performance FP32 (float): 240^* GFLOPS
Render Config L1 Cache: 8 KB (per CU)^*
Top MEMORY TYPE: GDDR3^*

Specifiche 5 · 26 campi

manufacturer: AMD^*
manufacturer: AMD^*
rop: 2^*
rop: 4^*
pixelShader: 2^*
vertexShader: 0^*
igp: Yes^*
igp: No^*
bus: PCIe 2.0 x16^*
bus: AGP 4x^*
memType: GDDR3^*
gpuChip: Crush11^*
gpuChip: Seymour^*
productName: FirePro M3900^*
productName: FirePro M3900^*
releaseYear: 2.010^*
releaseYear: 2.010^*
memSize: 1,024^*
memSize: 1,024^*
memBusWidth: 64^*
gpuClock: 175^*
gpuClock: 750^*
memClock: 900^*
unifiedShader: 160^*
tmu: 8^*
tmu: 4^*

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