FirePro 2270 PCIe x1

Processore grafico

Memoria video: 512 MB^*
Bus di memoria: 64 bit^*
Banda di memoria nominale: 9,60 GB/s^*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Architettura: TeraScale 2^*
Nodo produttivo: 40 nm^*
Frequenza base GPU: 600 MHz^*

Memoria e archiviazione

Memoria video: 512 MB^*
Tipo memoria video: GDDR3^*
Bus di memoria: 64 bit^*
Banda di memoria nominale: 9,60 GB/s^*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 50 campi

Brand: AMD^*
Top BUS WIDTH: 64^* bit
Graphics Processor GPU Name: Cedar^*
Graphics Processor Architecture: TeraScale 2^*
Graphics Processor Process Size: 40^* nm
Graphics Processor Transistors: 292 million^*
Graphics Processor Die Size: 59^* mm²
Graphics Card Release Date: Jan 31st, 2011^*
Graphics Card Generation: FirePro Multi-View (2200)^*
Graphics Card Production: End-of-life^*
Name: FirePro 2270 PCIe x1^*
Graphics Card Bus Interface: PCIe 2.0 x1^*
Clock Speeds GPU Clock: 600^* MHz
Clock Speeds Memory Clock: 600 MHz 1200 Mbps effective^*
Memory Memory Size: 512^* MB
Memory Memory Type: GDDR3^*
Memory Memory Bus: 64^* bit
Memory Bandwidth: 9,6^* GB/s
Render Config TMUs: 8^*
Top GRAPHICS PROCESSOR: Cedar^*
Render Config ROPs: 4^*
Theoretical Performance Pixel Rate: 2.400 GPixel/s
Theoretical Performance Texture Rate: 4.800 GTexel/s
Board Design Slot Width: Single-slot^*
Board Design TDP: 15^* W
Board Design Suggested PSU: 200^* W
Board Design Outputs: 1x DMS-59^*
Board Design Board Number: 109-C32081-00^*
Graphics Features DirectX: 11.2 (11_0)^*
Graphics Features OpenGL: 4,4^*
Graphics Features OpenCL: 1,2^*
source file: amd2011.json^*
Graphics Processor Foundry: TSMC^*
Recommended Resolutions: Playable:640x480 | Unplayable:1280x720 | Unplayable:1366x768^*
Board Design Length: 170 mm 6.7 inches^*
Graphics Processor GPU Variant: Cedar WS^*
Graphics Processor Density: 4.9M / mm²^*
Board Design Height: 69 mm 2.7 inches^*
Top TMUS: 8^*
Graphics Processor Chip Package: FCBGA-631^*
Top ROPS: 4^*
Graphics Features Shader Model: 5.0^*
Top CORES: 80^*
Render Config Shading Units: 80^*
Render Config Compute Units: 1^*
Render Config L2 Cache: 128^* KB
Top MEMORY SIZE: 512^* MB
Theoretical Performance FP32 (float): 96^* GFLOPS
Render Config L1 Cache: 8 KB (per CU)^*
Top MEMORY TYPE: GDDR3^*

Specifiche 2 · 26 campi

manufacturer: AMD^*
manufacturer: AMD^*
rop: 2^*
rop: 4^*
pixelShader: 2^*
vertexShader: 2^*
igp: Yes^*
igp: No^*
bus: PCIe 2.0 x1^*
bus: PCI^*
memType: GDDR3^*
gpuChip: RC410^*
gpuChip: Cedar^*
productName: FirePro 2270 PCIe x1^*
productName: FirePro 2270 PCIe x1^*
releaseYear: 2.011^*
releaseYear: 2.011^*
memSize: 0,512^*
memSize: 0,512^*
memBusWidth: 64^*
gpuClock: 300^*
gpuClock: 600^*
memClock: 600^*
unifiedShader: 80^*
tmu: 2^*
tmu: 8^*

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