GeekRadar / Il banco di confronto
CONFRONTA.
CPU
Unspecified

Xeon 3.20

Processore

Core CPU
1*
Thread CPU
1*
Potenza termica di progetto
97 W*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Core CPU
1*
Thread CPU
1*
Frequenza base
3,2 GHz*
Clock di riferimento CPU
133 MHz*
Frequenza CPU riportata
3,2 GHz*
Cache L3
1 MB*
Socket / package
Intel Socket 604*
Nodo produttivo
130 nm*
Area del chip dichiarata
237 mm²*
TDP chip/package
97 W*
Transistor
286 million*

Specifiche di potenza

Potenza termica di progetto
97 W*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 9 campi
Release
Oct 6th, 2003*
Name
Xeon 3.20*
Codename
Gallatin*
Cores
1*
Clock
3,2* GHz
Socket
Socket 604*
Process
130* nm
L3 Cache
1MB*
TDP
97* W
Specifiche 2 · 54 campi
name
Xeon 3.20*
name
Xeon 3.20*
Release Date
Feb 1st, 2004*
Release Date
Oct 6th, 2003*
Part#
RK80532KE0881M*
Part#
RK80532KE0882M*
Frequency
3,2* GHz
Frequency
3,2* GHz
Base Clock
133* MHz
Base Clock
133* MHz
Multiplier
24.0x*
Multiplier
24.0x*
Multiplier Unlocked
No*
Multiplier Unlocked
No*
Voltage
1,475* V
Voltage
1,475* V
Codename
Gallatin*
Codename
Gallatin*
Socket
Intel Socket 604*
Socket
Intel Socket 604*
Generation
Xeon (Gallatin)*
Generation
Xeon (Gallatin)*
ECC Memory
Yes*
ECC Memory
Yes*
# of Cores
1*
# of Cores
1*
# of Threads
1*
# of Threads
1*
SMP # CPUs
2*
SMP # CPUs
2*
Cache L1
8* KB
Cache L1
8* KB
Cache L2
512* KB
Cache L2
512* KB
Features
MMX, SSE1, SSE2*
Features
MMX, SSE1, SSE2*
Foundry
Intel*
Foundry
Intel*
Memory Bus
Dual-channel*
Memory Bus
Dual-channel*
Process Size
130* nm
Process Size
130* nm
Cache L3
2* MB
Cache L3
1* MB
Transistors
286 million*
Transistors
286 million*
Die Size
237* mm²
Die Size
237* mm²
Package
µPGA*
Package
µPGA*
Market
Server/Workstation*
Market
Server/Workstation*
Production Status
End-of-life*
Production Status
End-of-life*
Specifiche 3 · 20 campi
Foundry
Intel*
Foundry
Intel*
Vendor
Intel*
Vendor
Intel*
Product
Intel Xeon 3.20*
Product
Intel Xeon 3.20*
Type
CPU*
Type
CPU*
Release Date
2004-02-01*
Release Date
2003-10-06*
Process Size (nm)
130* nm
Process Size (nm)
130* nm
TDP (W)
97* W
TDP (W)
97* W
Die Size (mm^2)
237* mm²
Die Size (mm^2)
237* mm²
Transistors (million)
286*
Transistors (million)
286*
Freq (MHz)
3.200* MHz
Freq (MHz)
3.200* MHz

* Dati provvisori