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CONFRONTA.
CPU
Unspecified

Xeon 3.0

Processore

Core CPU
1*
Thread CPU
1*
Potenza termica di progetto
135 W*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Core CPU
1*
Thread CPU
1*
Frequenza base
3 GHz*
Clock di riferimento CPU
200 MHz*
Frequenza CPU riportata
3 GHz*
Socket / package
Socket 604*
Nodo produttivo
90 nm*
Area del chip dichiarata
Valore riportato 1: 169 mm²*
Valore riportato 2: 135 mm²*
TDP chip/package
135 W*
Transistor
Valore riportato 1: 155 million*
Valore riportato 2: 178 million*

Specifiche di potenza

Potenza termica di progetto
135 W*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 8 campi
Release
Jun 28th, 2004*
Name
Xeon 3.0*
Codename
Nocona*
Cores
1*
Clock
3* GHz
Socket
Socket 604*
Process
90* nm
TDP
135* W
Specifiche 2 · 50 campi
name
Xeon 3.0*
name
Xeon 3.0*
Release Date
Feb 14th, 2005*
Release Date
Jun 28th, 2004*
Frequency
3* GHz
Frequency
3* GHz
Base Clock
200* MHz
Base Clock
200* MHz
Multiplier
15.0x*
Multiplier
15.0x*
Multiplier Unlocked
No*
Multiplier Unlocked
No*
Voltage
1,4* V
Voltage
1,412* V
Codename
Nocona*
Codename
Irwindale*
Socket
Intel Socket 604*
Socket
Intel Socket 604*
Generation
Xeon (Nocona)*
Generation
Xeon (Irwindale)*
ECC Memory
Yes*
ECC Memory
Yes*
# of Cores
1*
# of Cores
1*
# of Threads
1*
# of Threads
1*
SMP # CPUs
1*
SMP # CPUs
1*
Cache L1
16* KB
Cache L1
16* KB
Cache L2
1* MB
Cache L2
2* MB
Features
MMX, SSE1, SSE2, SSE3, NX-Bit, EIST, Intel 64*
Features
MMX, SSE1, SSE2, SSE3, NX-Bit, EIST, Intel 64*
Foundry
Intel*
Foundry
Intel*
Memory Bus
Dual-channel*
Memory Bus
Dual-channel*
Process Size
90* nm
Process Size
90* nm
Transistors
178 million*
Transistors
155 million*
Die Size
135* mm²
Die Size
169* mm²
Package
µPGA*
Package
µPGA*
Market
Server/Workstation*
Market
Server/Workstation*
Production Status
End-of-life*
Production Status
End-of-life*
Specifiche 3 · 20 campi
Foundry
Intel*
Foundry
Intel*
Vendor
Intel*
Vendor
Intel*
Product
Intel Xeon 3.0*
Product
Intel Xeon 3.0*
Type
CPU*
Type
CPU*
Release Date
2004-06-28*
Release Date
2005-02-14*
Process Size (nm)
90* nm
Process Size (nm)
90* nm
TDP (W)
135* W
TDP (W)
135* W
Die Size (mm^2)
169* mm²
Die Size (mm^2)
135* mm²
Transistors (million)
155*
Transistors (million)
178*
Freq (MHz)
3.000* MHz
Freq (MHz)
3.000* MHz

* Dati provvisori