Mobile Athlon 64 3200+

Processore

Core CPU: 1^*
Thread CPU: 1^*
Potenza termica di progetto: Valore riportato 1: 82 W^*
Valore riportato 2: 62 W^*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Core CPU: 1^*
Thread CPU: 1^*
Frequenza base: 2 GHz^*
Clock di riferimento CPU: 2.000 MHz^*
Socket / package: Socket 754^*

Specifiche di potenza

Potenza termica di progetto: Valore riportato 1: 82 W^*
Valore riportato 2: 62 W^*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 16 campi

Release: Aug 1st, 2004^*
Release: Aug 1st, 2003^*
Name: Mobile Athlon 64 3200+^*
Name: Mobile Athlon 64 3200+^*
Codename: Clawhammer^*
Codename: Clawhammer^*
Cores: 1^*
Cores: 1^*
Clock: 2.000^* MHz
Clock: 2.000^* MHz
Socket: Socket 754^*
Socket: Socket 754^*
Process: 130^* nm
Process: 130^* nm
TDP: 82^* W
TDP: 62^* W

Specifiche 2 · 54 campi

name: Mobile Athlon 64 3200+^*
name: Mobile Athlon 64 3200+^*
Release Date: Aug 1st, 2004^*
Release Date: Aug 1st, 2003^*
Part#: AMA3200BEX5AP AMA3200BEX5AR^*
Part#: AMN3200BIX5AP AMN3200BIX5AR^*
Frequency: 2.000^* MHz
Frequency: 2.000^* MHz
Base Clock: 2.000^* MHz
Base Clock: 2.000^* MHz
Multiplier: 10.0x^*
Multiplier: 10.0x^*
Multiplier Unlocked: No^*
Multiplier Unlocked: No^*
Voltage: 1,5^* V
Voltage: 1,4^* V
Codename: Clawhammer^*
Codename: Clawhammer^*
Socket: AMD Socket 754^*
Socket: AMD Socket 754^*
Generation: Mobile Athlon 64 (ClawHammer)^*
Generation: Mobile Athlon 64 (ClawHammer)^*
Memory Support: DDR1^*
Memory Support: DDR1^*
ECC Memory: No^*
ECC Memory: No^*
# of Cores: 1^*
# of Cores: 1^*
# of Threads: 1^*
# of Threads: 1^*
SMP # CPUs: 1^*
SMP # CPUs: 1^*
Integrated Graphics: On certain motherboards (Chipset feature)^*
Integrated Graphics: On certain motherboards (Chipset feature)^*
Cache L1: 128^* KB
Cache L1: 128^* KB
Cache L2: 1^* MB
Cache L2: 1^* MB
Features: MMX, 3DNow!, SSE, SSE2, AMD64^*
Features: MMX, 3DNow!, SSE, SSE2, AMD64^*
Memory Bus: Single-channel^*
Memory Bus: Single-channel^*
Process Size: 130^* nm
Process Size: 130^* nm
Transistors: 106 million^*
Transistors: 106 million^*
Die Size: 193^* mm²
Die Size: 193^* mm²
Package: µPGA^*
Package: µPGA^*
Market: Mobile^*
Market: Mobile^*
Production Status: End-of-life^*
Production Status: End-of-life^*

* Dati provvisori