Core i9-13900HK

Processore

Thread CPU: 20^*
Frequenza boost massima: 5,4 GHz^*
Potenza termica di progetto: 45 W^*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Thread CPU: 20^*
Frequenza base: 2,6 GHz^*
Clock di riferimento CPU: 100 MHz^*
Frequenza base core efficienti: 1,9 GHz^*
Turbo massimo core efficienti: 4,1 GHz^*
Frequenza boost massima: 5,4 GHz^*
Cache L3: 24 MB^*
Socket / package: BGA 1744^*

Specifiche di potenza

Potenza termica di progetto: 45 W^*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 9 campi

Release: Jan 4th, 2023^*
Name: Core i9-13900HK^*
Codename: Raptor Lake-H^*
Cores: 14 / 20^*
Clock: 2.6 to 5.4 GHz^*
Socket: BGA 1744^*
Process: 10^* nm
L3 Cache: 24MB^*
TDP: 45^* W

Specifiche 2 · 48 campi

name: Core i9-13900HK^*
Release Date: Jan 4th, 2023^*
Part#: SRMJ3^*
Frequency: 2,6^* GHz
Turbo Clock: up to 5.4 GHz^*
Base Clock: 100^* MHz
Multiplier: 26.0x^*
Multiplier Unlocked: Yes^*
Codename: Raptor Lake-H^*
Socket: Intel BGA 1744^*
Generation: Core i9 (Raptor Lake-H)^*
Memory Support: DDR4, DDR5^*
ECC Memory: No^*
# of Cores: 14^*
# of Threads: 20^*
SMP # CPUs: 1^*
Integrated Graphics: Iris Xe Graphics 96EU^*
Cache L1: 80 KB (per core)^*
Cache L2: 2 MB (per core)^*
Features: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, AVX, AVX2, FMA3, SHA, EIST, Intel 64, XD bit, VT-x, VT-d, AES-NI, TSX, TXT, CLMUL, F16C, BMI1, BMI2, ABM, ADX, RdRand, TBT 2.0, TBT 3.0^*
Foundry: Intel^*
Memory Bus: Dual-channel^*
tJMax: 100°C^*
Launch Price: $697^*
DDR4 Speed: 3.200^* MT/s
LPDDR5 Speed: 6.400^* MT/s
PCI-Express: Gen 5, 8 Lanes (CPU only)^*
Process Size: 10^* nm
Cache L3: 24 MB (shared)^*
tCaseMax: 72°C^*
Chipsets: WM790, HM770^*
PL1: 45^* W
PL2: 115^* W
Die Size: 257^* mm²
E-Core Frequency: 1900 MHz up to 4.1 GHz^*
LPDDR4x Speed: 4.267^* MT/s
Hybrid Cores: P-Cores: 6 E-Cores: 8^*
E-Core L1: 96 KB (per core)^*
E-Core L2: 4 MB (per module)^*
DDR5 Speed: 5.200^* MT/s
Minimum Power: 35^* W
PCH PCIe: Gen 3, 12 Lanes^*
Secondary PCIe: Gen 4, 8 Lanes^*
Package: FC-BGA16F^*
P-Core Boost 3.0: 5,4^* GHz
PL2 Tau Limit: 28 seconds^*
Market: Mobile^*
Production Status: Active^*

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