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CONFRONTA.
CPU
Unspecified

Core i3-2312M

Processore

Core CPU
2*
Thread CPU
4*
Potenza termica di progetto
35 W*

Non sono ancora disponibili benchmark associati a questa scheda.

Elaborazione e piattaforma

Core CPU
2*
Thread CPU
4*
Frequenza base
2,1 GHz*
Clock di riferimento CPU
100 MHz*
Cache L3
3 MB*
Socket / package
Valore riportato 1: BGA 1023*
Valore riportato 2: Intel BGA 1023*
Valore riportato 3: Socket G2 (988B)*
Valore riportato 4: Intel Socket G2 (988B)*

Specifiche di potenza

Potenza termica di progetto
35 W*

Configurazione di sistema

Specifiche dettagliate

Specifiche 1 · 18 campi
Release
Mar 1st, 2011*
Release
Sep 1st, 2011*
Name
Core i3-2312M*
Name
Core i3-2312M*
Codename
Sandy Bridge*
Codename
Sandy Bridge*
Cores
2 / 4*
Cores
2 / 4*
Clock
2,1* GHz
Clock
2,1* GHz
Socket
BGA 1023*
Socket
Socket G2 (988B)*
Process
32* nm
Process
32* nm
L3 Cache
3MB*
L3 Cache
3MB*
TDP
35* W
TDP
35* W
Specifiche 2 · 58 campi
name
Core i3-2312M*
name
Core i3-2312M*
Release Date
Mar 1st, 2011*
Release Date
Sep 1st, 2011*
Part#
SR04P SR09S*
Frequency
2,1* GHz
Frequency
2,1* GHz
Base Clock
100* MHz
Base Clock
100* MHz
Multiplier
21.0x*
Multiplier
21.0x*
Multiplier Unlocked
No*
Multiplier Unlocked
No*
TDP
35* W
TDP
35* W
Codename
Sandy Bridge*
Codename
Sandy Bridge*
Socket
Intel BGA 1023*
Socket
Intel Socket G2 (988B)*
Generation
Core i3 (Sandy Bridge)*
Generation
Core i3 (Sandy Bridge)*
Memory Support
DDR3*
Memory Support
DDR3*
ECC Memory
No*
ECC Memory
No*
# of Cores
2*
# of Cores
2*
# of Threads
4*
# of Threads
4*
SMP # CPUs
1*
SMP # CPUs
1*
Integrated Graphics
Intel HD 3000*
Integrated Graphics
Intel HD 3000*
Cache L1
64 KB (per core)*
Cache L1
64 KB (per core)*
Cache L2
256 KB (per core)*
Cache L2
256 KB (per core)*
Features
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, EIST, Intel 64, XD bit, VT-x, HTT, Smart Cache*
Features
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, EIST, Intel 64, XD bit, VT-x, HTT, Smart Cache*
Foundry
Intel*
Foundry
Intel*
Memory Bus
Dual-channel*
Memory Bus
Dual-channel*
Process Size
32* nm
Process Size
32* nm
Cache L3
3 MB (shared)*
Cache L3
3 MB (shared)*
tCaseMax
85°C*
Transistors
624 million*
Transistors
624 million*
Die Size
149* mm²
Die Size
149* mm²
Package
rPGA*
Package
rPGA*
Market
Mobile*
Market
Mobile*
Production Status
End-of-life*
Production Status
End-of-life*
Specifiche 3 · 11 campi
product
Core i3-2312M*
lith
32*
status
Discontinued*
integratedG
Intel HD 3000 Graphics*
releaseDate
2.011*
cores
2*
threads
4*
baseClock
2,1*
cache
35*
cacheInfo
Intel Smart Cache*
TDP
3*

* Dati provvisori